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The possible use of poly(ethylene naphthalate) as substrate for thin silicon solar cells has been studied in this paper. The transparency of this polymer makes it a candidate to be used in both substrate and superstrate configurations. ZnO:Al has been deposited at room temperature on top of PEN. The resulting structure PEN/ZnO:Al presented good optical and electrical properties. PEN has been successfully textured (nanometer and micrometer random roughness) using Hot-Embossing Lithography. Reflector structures have been built depositing Ag and ZnO:Al on top of the stamped polymer. The deposition of these layers did not affect the final roughness of the whole. The reflector structure has been morphologically and optically analysed to verify its suitability to be used in solar cells.

In this work, we have studied the texturization process of (100) c-Si wafers using a low concentration potassium hydroxide solution in order to obtain good quality textured

This work studies the use of polymeric layers of polyethylenimine (PEI) as an interface modification of electron-selective contacts. A clearly enhanced electrical transport with lower contact resistance and significant surface passivation (about 3 ms) can be achieved with PEI modification. As for other conjugated polyelectrolytes, protonated groups of the polymer with their respective counter anions from the solvent create an intense dipole. In this work, part of the amine groups in PEI are protonated by ethanol that behaves as a weak Brønsted acid during the process. A comprehensive characterization including high-resolution compositional analysis confirms the formation of a dipolar interlayer. The PEI modification is able to eliminate completely Fermi-level pinning at metal/semiconductor junctions and shifts the work function of the metallic electrode by more than 1 eV. Induced charge transport between the metal and the semiconductor allows the formation of an electron accumulation region. Consequently, electron-selective contacts are clearly improved with a significant reduction of the specific contact resistance (less than 100 mΩ·cm2). Proof-of-concept dopant-free solar cells on silicon were fabricated to demonstrate the beneficial effect of PEI dipolar interlayers. Full dopant-free solar cells with conversion efficiencies of about 14% could be fabricated on flat wafers. The PEI modification also improved the performance of classical high-efficiency heterojunction solar cells.

In this work, 50-nm thick Al 2 O 3 thin films were deposited at room temperature by magnetron sputtering from an Al 2 O 3 ceramic target at different RF power and argon pressure values. The sputtering technique could be preferred to conventional atomic layer deposition for an industrial application, owing to its simplicity, availability, and higher deposition rate. The resulting thin films were characterized by UV/Vis/NIR spectroscopy, X-ray diffraction, and X-ray photoelectron spectroscopy. The deposited Al 2 O 3 material was always highly transparent and amorphous in nature. It was found that the O/Al ratio is higher when the Al 2 O 3 layer is deposited at lower RF power or higher argon pressure. Also, some argon incorporation into the films was observed at low deposition pressure. On the other hand, the performance of the previously characterized Al 2 O 3 thin films in the passivation of 2.25-Ωcm p-type float zone c-Si wafer surfaces was evaluated by the quasi-steady-state photoconductance technique. The best effective carrier lifetime value at one-sun illumination, 0.34 ms (corresponding to a surface recombination velocity of 41 cm/s), was obtained with the 50-nm Al 2 O 3 deposited at the higher argon pressure studied, 0.67 Pa (5.0 mTorr), with the lowest RF power studied, 150 W (corresponding to a power density of 3.3 W/cm 2), and after an annealing process, in this case at 350 ºC for 20 min with forming gas. It was assumed that the reduction of the surface passivation quality at higher RF power or lower argon pressure is a consequence of an increased surface damage, and, probably, to a decrease of the O/Al ratio of the Al 2 O 3 passivation material. These assumptions were confirmed with the obtainment of a lifetime of 0.73 ms (a surface recombination velocity equal to 19 cm/s) with a simple experiment with Al 2 O 3 deposited with progressively varied sputtering conditions started from minimal silicon surface damage conditions: 50 W (corresponding to a power density of 1.1 W/cm 2) and 6.67 Pa (50 mTorr). Finally, comments about further improvement of the effective lifetime (up to 1.25 ms, corresponding to a surface recombination velocity of 11 cm/s) with preliminary experiments about the incorporation of an intrinsic hydrogenated amorphous silicon interlayer are included.