The authors report a significant reduction in deep level defects and improvement of carrier lifetime in 4H-SiC material after carrying out carbon or silicon ion implantation into the shallow surface layer of 250nm and subsequent annealing at 1600°C or higher temperature. Reduction of Z1∕2 and EH6∕7 traps from 3×1013cm−3 to below the detection limit (5×1011cm−3) was observed by deep level transient spectroscopy in the material 4μm underneath the implanted layer. Minority carrier lifetime almost doubled in the implanted samples compared to the unimplanted samples. The authors propose that the implanted layer acts as a source of carbon interstitials which indiffuse during annealing and accelerate annealing out of grown-in defects in the layer underneath the implanted region.
We investigated the structure of in-grown stacking faults in the 4H–SiC(0001) epilayers. The in-grown stacking faults nucleate near the substrate/epilayer interface and expand the area with increasing epilayer thickness in a triangular shape. From transmission electron microscope observation, the formation of 1c of 8H polytype was confirmed in the in-grown stacking fault area. We also investigated the dependence of in-grown stacking fault density on the epitaxial growth rate, growth temperature, and substrate surface preparation.
The authors investigated the application of the carbon-implantation/annealing method for the annealing of the main lifetime limiting defect Z1∕2 in thick 4H–SiC epilayers. Examination of different implantation doses and annealing temperatures showed that finding the optimum conditions is crucial for obtaining thick layers with carrier trap concentration below 1011cm−3 in the whole 100μm epilayer. The carrier lifetime increased from less than 200ns to over 1μs at room temperature in the samples annealed with the carbon-implanted layer. The thick 4H–SiC epilayers after the application of the carbon-implantation/annealing were confirmed to be applicable for fabrication of high-voltage bipolar devices and resulted in improved conductivity modulation. Possible annealing mechanisms are discussed in detail making a comparison between annealing of as-grown material and irradiated material.
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