The reduction of parasitic recombination processes commonly occurring within the silicon crystal and at its surfaces is of primary importance in crystalline silicon devices, particularly in photovoltaics. Here we explore a simple, room temperature treatment, involving a nonaqueous solution of the superacid bis(trifluoromethane)sulfonimide, to temporarily deactivate recombination centers at the surface. We show that this treatment leads to a significant enhancement in optoelectronic properties of the silicon wafer, attaining a level of surface passivation in line with state-of-the-art dielectric passivation films. Finally, we demonstrate its advantage as a bulk lifetime and process cleanliness monitor, establishing its compatibility with large area photoluminescence imaging in the process.

No abstract

No abstract

It has previously been shown that ex situ phosphorus-doped polycrystalline silicon on silicon oxide (poly-Si/SiO x ) passivating contacts can suffer a pronounced surface passivation degradation when subjected to a firing treatment at 800 °C or above. The degradation behavior depends strongly on the processing conditions, such as the dielectric coating layers and the firing temperature. The current work further studies the firing stability of poly-Si contacts and proposes a mechanism for the observed behavior based on the role of hydrogen. Secondary ion mass spectrometry is applied to measure the hydrogen concentration in the poly-Si/SiO x structures after firing at different temperatures and after removing hydrogen by an anneal in nitrogen. While it is known that a certain amount of hydrogen around the interfacial SiO x can be beneficial for passivation, surprisingly, we found that the excess amount of hydrogen can deteriorate the poly-Si passivation and increase the recombination current density parameter J 0. The presence of excess hydrogen is evident in selected poly-Si samples fired with silicon nitride (SiN x ), where the injection of additional hydrogen to the SiO x interlayer leads to further degradation in the J 0, while removing hydrogen fully recovers the surface passivation. In addition, the proposed model explains the dependence of firing stability on the crystallite properties and the doping profile, which determine the effective diffusivity of hydrogen upon firing and hence the amount of hydrogen around the interfacial SiO x after firing.

No abstract

No abstract

High-performance multicrystalline silicon (HP mc-Si) from directional solidification has become the mainstream industrial material for fabricating mc-Si based solar cells for photovoltaic applications. Transition metal impurities are inherently contained in HP mc-Si during ingot growth, and they are one of the major efficiency-limiting drawbacks. In this work, we investigate the gettering of transition metals (Cu, Ni, Fe, and Cr) in HP mc-Si wafers along an industrial-standard p-type HP mc-Si ingot, via examining the metal concentration and distribution in the near-surface gettering layers using secondary ion mass spectrometry. We applied both conventional phosphorus diffusion gettering and the recently developed silicon nitride (from plasma-enhanced chemical vapour deposition) gettering techniques. Both techniques are shown to remove significant quantities of metals from the silicon wafer bulk to the surface gettering layers. Improvements in the bulk minority carrier lifetimes throughout the ingot height are also observed by lifetime measurements and spatially-resolved photoluminescence imaging. The gettered Cu and Ni concentrations, as well as the as-grown dissolved Fe concentrations in the silicon wafer bulk, along the HP mc-Si ingot height are shown to follow a similar concentration profile as the metals in conventional mc-Si ingots.

We present a method based on steady state photoluminescence (PL) imaging and modelling of the PL intensity profile across a grain boundary (GB) using 2D finite element analysis, to quantify the recombination strength of a GB in terms of the effective surface recombination velocity ðS ef f Þ. This quantity is a more meaningful and absolute measure of the recombination activity of a GB compared to the commonly used signal contrast, which can strongly depend on other sample parameters, such as the intra-grain bulk lifetime. The method also allows the injection dependence of the S ef f of a given GB to be explicitly determined. The method is particularly useful for studying the responses of GBs to different cell processing steps, such as phosphorus gettering and hydrogenation. The method is demonstrated on double-side passivated multicrystalline wafers, both before and after gettering, and single-side passivated wafers with a strongly non-uniform carrier density profile depth-wise. Good agreement is found between the measured PL profile and the simulated PL profile for both cases. We demonstrate that single-side passivated wafers allow more recombination active grain boundaries to be analysed with less unwanted influence from nearby features. The sensitivity limits and other practical constraints of the method are also discussed.