We have fabricated the electro-optical layer where the optical waveguide with 45° mirror plane was formed on Cu side of the flexible copper clad laminate (FCCL) using conventional printed circuit board (PCB) technologies such as vacuum lamination, UV exposure, development and CO2 laser machining. These techniques are expected to give a low cost platform solution for the optical interconnection module in mobile phone applications.
We have investigated the defects observed in the multimode waveguide fabricated on the flexible copper clad laminate using vacuum lamination of film-type raw material, UV exposure and development processes. The excess loss caused by the defects was estimated using the simulation method and the estimated values were found to be well matched with the measured ones except the trapped void type defect which gives excess loss larger than 1 dB by a single defect. From these results, we proposed how the allowable defect size can be determined using the visual inspection system.
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