Conventional Printed Circuit Board Technology Approach for an Electro-Optical Layer

Abstract

We have fabricated the electro-optical layer where the optical waveguide with 45° mirror plane was formed on Cu side of the flexible copper clad laminate (FCCL) using conventional printed circuit board (PCB) technologies such as vacuum lamination, UV exposure, development and CO2 laser machining. These techniques are expected to give a low cost platform solution for the optical interconnection module in mobile phone applications.

Forty-Five Degree Micromirror Fabrication Using Silicon Anisotropic Etching with Surfactant-Added Tetramethylammonium Hydroxide Solution

“…1,2) For mobile phones, for example, the optical interconnection is intended to be applied between the application processor and the display driver through the folding hinge and is expected to have a capability of high-rate serial data transmission of 1-3 Gbps or more. [2][3][4] Although some obstacles such as cost and/or power consumption currently exist, the growing problems due to the current electrical interconnection, such as electromagnetic interference (EMI) and/or impedance mismatching, motivate us to realize a system applying optical interconnection technology. [1][2][3][4] Generally, the proposed optical interconnection module consists of a transmitter block (Tx), a receiver block (Rx), and a connecting line between them.…”

“…[2][3][4] Although some obstacles such as cost and/or power consumption currently exist, the growing problems due to the current electrical interconnection, such as electromagnetic interference (EMI) and/or impedance mismatching, motivate us to realize a system applying optical interconnection technology. [1][2][3][4] Generally, the proposed optical interconnection module consists of a transmitter block (Tx), a receiver block (Rx), and a connecting line between them. 1,2) There are two types of connecting line: one is an optical waveguide 2,3) and the other is an optical fiber.…”

Determination of allowable defect size in multimode polymer waveguides fabricated by printed circuit board compatible processes

“…Currently, optical interconnects are attracting interest for mobile applications where both high-speed digital signals of image and/or video data and various RF signals are used in a very compact space [1][2][3]. The optical interconnection module based on a flexible optical PCB schematically shown in figure 1 is a promising physical form for mobile phone application [3].…”

“…Currently, optical interconnects are attracting interest for mobile applications where both high-speed digital signals of image and/or video data and various RF signals are used in a very compact space [1][2][3]. The optical interconnection module based on a flexible optical PCB schematically shown in figure 1 is a promising physical form for mobile phone application [3]. The optical layer is placed between the two electrical layers, and the optical devices of VCSEL and PD are placed in the optical via holes formed in the rigid area, while the mirror plane is machined at the backside.…”

Industry Compatible Embossing Process for the Fabrication of Waveguide-Embedded Optical Printed Circuit Boards

“…Three common techniques, namely laser writing [12], photolithography [13]- [17], and embossing [18]- [22], have been demonstrated for the production of polymer waveguides for PCB applications. The embossing technique is potentially a costeffective solution, as it relies on repeated use of a mold to form replicas.…”