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Because of the aggressive scaling of integrated circuits and the given limits of atomic scales, circuit designers have to become more and more aware of the arising reliability and yield concerns. So far, only very little research efforts have been put into lowlevel approaches for lifetime reliability, whereas lots of efforts have focused on soft-errors and system-level solutions. In this paper, we introduce and compare three diverse design approaches which apply redundancy on different abstraction levels to enhance the reliability of a Wallace multiplier as regards gate oxide breakdown. The results of the test design were further improved by adding transistors and gates with different gate oxide thicknesses. The achieved results show that lifetime reliability increases up to 200 % at constant delay by adding redundant gates, subsequently called Twin Logic Gates. However, this comes at the price of overhead for area as well as power consumption. Furthermore, it needs to be noted that the presented strategies can additionally improve defect yield.

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