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Abstract-This paper introduces a 3D-stacked logic-in-memory (LiM) system that integrates the 3D die-stacked DRAM architecture with the application-specific LiM IC to accelerate important data-intensive computing. The proposed system comprises a fine-grained rank-level 3D die-stacked DRAM device and extra LiM layers implementing logic-enhanced SRAM blocks that are dedicated to a particular application. Through silicon vias (TSVs) are used for vertical interconnections providing the required bandwidth to support the high performance LiM computing. We performed a comprehensive 3D DRAM design space exploration and exploit the efficient architectures to accelerate the computing that can balance the performance and power. Our experiments demonstrate orders of magnitude of performance and power efficiency improvements compared with the traditional multithreaded software implementation on modern CPU.

Abstract-This paper introduces a 3D-stacked logic-in-memory (LiM) system to accelerate the processing of sparse matrix data that is held in a 3D DRAM system. We build a customized content addressable memory (CAM) hardware structure to exploit the inherent sparse data patterns and model the LiM based hardware accelerator layers that are stacked in between DRAM dies for the efficient sparse matrix operations. Through silicon vias (TSVs) are used to provide the required high inter-layer bandwidth. Furthermore, we adapt the algorithm and data structure to fully leverage the underlying hardware capabilities, and develop the necessary design framework to facilitate the design space evaluation and LiM hardware synthesis. Our simulation demonstrates more than two orders of magnitude of performance and energy efficiency improvements compared with the traditional multithreaded software implementation on modern processors.

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