The current state of wide bandgap device technology is reviewed and its impact on power electronic system miniaturization for a wide variety of voltage levels is described. A synopsis of recent complementary technological developments in passives, integrated driver, and protection circuitry and electronic packaging are described, followed by an outline of the applications that stand to be impacted. A glimpse into the future based on the current technological trends is offered.Index Terms-Gallium nitride (GaN), power electronics, power integrated circuits, power semiconductor devices, silicon carbide (SiC), wide bandgap semiconductors.

This paper evaluates the capability of SiC power semiconductor devices, in particular JFET and Schottky barrier diodes (SBD) for application in high-temperature power electronics. SiC JFETs and SBDs were packaged in high temperature packages to measure the dc characteristics of these SiC devices at ambient temperatures ranging from 25 C (room temperature) up to 450 C. The results show that both devices can operate at 450 C, which is impossible for conventional Si devices, at the expense of significant derating. The current capability of the SiC SBD does not change with temperature, but as expected the JFET current decreases with rising temperatures. A 100V, 25W dc-dc converter is used as an example of a high-temperature power-electronics circuit because of circuit simplicity. The converter is designed and built in accordance with the static characteristics of the SiC devices measured under extremely high ambient temperatures, and then tested up to an ambient temperature of 400 C. The conduction loss of the SiC JFET increases slightly with increasing temperatures, as predicted from its dc characteristics, but its switching characteristics hardly change. Thus, SiC devices are well suited for operation in harsh temperature environments like aerospace and automotive applications. Index Terms-dc-dc converter circuit, device characterization, high temperature operation, packaging, silicon carbide (SiC) device. I. INTRODUCTION S ILICON CARBIDE (SiC) has several superior characteristics over silicon (Si) when used as a semiconductor material [1]-[6]. In particular, SiC semiconductor devices are expected

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