No abstract

We have investigated the gettering of transition metals in multicrystalline silicon wafers during a phosphorus emitter diffusion for solar cell processing. The results show that mainly regions of high initial recombination lifetime exhibit a significant lifetime enhancement upon phosphorus diffusion gettering. Nevertheless, transition metal profiles extracted by secondary ion mass spectrometry in a region of low initial lifetime reveal significant gradients in Cr, Fe, and Cu concentrations towards the surface after the emitter diffusion, without exhibiting a significant enhancement in the lifetime. In a region of higher initial lifetime, however, diminutive concentration gradients of the transition metal impurities are revealed, indicating a significantly lower initial concentration in these regions. From spatial maps of the dislocation density in the wafers, we find that lifetime enhancements mainly occur in regions of low dislocation density. Thus, it is believed that a generally higher concentration of transition metals combined with an impurity decoration of dislocations in regions of high dislocation density limit the initial lifetime and the lifetime after the phosphorus diffusion, in spite of the notable gettering of transition metal impurities towards the surface in these regions. Furthermore, after a hydrogen release from overlying silicon nitride layers, we observe that only regions of low dislocation density experience a significant lifetime enhancement. This is attributed to impurity decoration of the dislocations in the regions of both high dislocation density and high transition metal impurity concentration, reducing the ability of hydrogen to passivate dislocations in these regions.

No abstract

No abstract

No abstract

A model for the combined effect of dislocations and grain boundaries on minority carrier lifetime has been developed. Lifetime varies with dislocation density, grain boundary misorientation, and the coincidence site lattice (CSL) nature of the boundaries. Minority carrier lifetime was measured with high spatial resolution (50 mu m) using the carrier density imaging (CDI) technique on a silicon nitride passivated multicrystalline sample. Dislocation density was measured on the same sample by image recognition of optical microscope pictures of a Secco etched surface. Grain boundaries were then mapped and characterized by electron backscatter diffraction (EBSD). Lifetime was simulated based on the dislocation and grain boundary measurements. Parameters were chosen to match closely the simulated and measured maps. Very good two-dimensional (2D) correlation was obtained by assigning roughly equal importance to recombination at dislocations and grain boundaries. The value for the capture cross section, which gives the best correlation, is 4x10(-14) cm(-3). This is in the range of values reported for interstitial transition metals like, for instance, iron. It appears necessary to include also the effect of grain boundaries to explain recombination in low lifetime areas. Sub grain boundaries were particularly recombination active and are dominating the number of active grain boundaries

No abstract

Abstract-In recent years, high-performance multicrystalline silicon (HPMC-Si) has emerged as an attractive alternative to traditional ingot-based multicrystalline silicon (mc-Si), with a similar cost structure but improved cell performance. Herein, we evaluate the gettering response of traditional mc-Si and HPMC-Si. Microanalytical techniques demonstrate that HPMC-Si and mc-Si share similar lifetime-limiting defect types but have different relative concentrations and distributions. HPMC-Si shows a substantial lifetime improvement after P-gettering compared with mc-Si, chiefly because of lower area fraction of dislocation-rich clusters. In both materials, the dislocation clusters and grain boundaries were associated with relatively higher interstitial iron point-defect concentrations after diffusion, which is suggestive of dissolving metal-impurity precipitates. The relatively fewer dislocation clusters in HPMC-Si are shown to exhibit similar characteristics to those found in mc-Si. Given similar governing principles, a proxy to determine relative recombination activity of dislocation clusters developed for mc-Si is successfully transferred to HPMC-Si. The lifetime in the remainder of HPMC-Si material is found to be limited by grain-boundary recombination. To reduce the recombination activity of grain boundaries in HPMC-Si, coordinated impurity control during growth, gettering, and passivation must be developed.