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In order to efficiently design complex microelectromechanical systems (MEMS) having large numbers of multi-domain components, a hierarchically structured design approach that is compatible with standard IC design is needed. A graphical-based schematic, or structural, view is presented as a geometrically intuitive way to represent MEMS as a set of interconnected lumpedparameter elements. An initial library focuses on suspended-MEMS technology from which inertial sensors and other mechanical mechanisms can be designed. The schematic representation has a simulation interface enabling the designer to simulate the design at the component level. Synthesis of MEMS cells for common topologies provides the system designer with rapid, optimized component layout and associated macro-models. A synthesis module is developed for the popular folded-flexure micromechanical resonator topology. The algorithm minimizes a combination of total layout area and voltage applied to the electromechanical actuators. Synthesis results clearly show the design limits of behavioral parameters such as resonant frequency for a fixed process technology.

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A fully-dry, flip-chip fabrication technology was developed for the integration of high fill factor, silicon-on-insulator (SOI) structures and CMOS-MEMS actuators. An SOI mirror array with a fill factor of 95% and radius of curvature >1.3 m was fabricated on CMOS-MEMS electrothermal actuators using this technology. The unloaded actuators achieved an optical scan range of >92º. Following flip-chip bonding with high temperature epoxy, the structures were released using deep reactive ion etching (DRIE). Aspect ratio dependent etching (ARDE) modulated local structural silicon thickness on the CMOS-MEMS actuators and reduced notching and microtrenching on the posts of the SOI mirrors.

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