Flip-Chip Integrated Soi-Cmos-Mems Fabrication Technology

Gilgunn, Peter J.; Fedder, G.K.

doi:10.31438/trf.hh2008.3

Cited by 8 publications

(10 citation statements)

References 11 publications

(13 reference statements)

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“…McManamon et al in 1993 [12], he published an all-thing-considered review paper to summarize its nearly 30 years of development [13] including liquid crystal polarization gratings to achieve 99.5% diffraction efficiency [14], simulation on high efficiency improvement [15], volume holographic to amplify steering angle [16], and the scattering free polymer network liquid crystal invented by Dr. Sun et al to overcome the transparency reduction on the submillisecond liquid crystal devices [17,18]. Meanwhile, the concept of LC-OPA has been suggested into the midinfrared domain [19] and even some alternative methods for steering laser beam such as lenslet array [20] and MEMS-based [21].…”

Section: Introductionmentioning

confidence: 99%

Theoretical and Experimental Demonstration on Grating Lobes of Liquid Crystal Optical Phased Array

Wu¹,

Li²,

Wu³

et al. 2016

International Journal of Optics

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High deflection efficiency is one of the urgent requirements for practical liquid crystal optical phased array (LC-OPA). In this paper, we demonstrate that high order grating lobes induced from fringe effect are the most important issue to reduce occupation of main lobe. A novel theoretical model is developed to analyze the feature of grating lobes when the device of LC-OPA is working on the scheme of variable period grating (VPG) or variable blazing grating (VBG). Subsequently, our experiments present the relevant results showing a good agreement with the theoretical analysis.

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Section: Introductionmentioning

confidence: 99%

Theoretical and Experimental Demonstration on Grating Lobes of Liquid Crystal Optical Phased Array

Wu¹,

Li²,

Wu³

et al. 2016

International Journal of Optics

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“…However, this method results in larger than 8 µm variation over a 1 mm distance on the backside Si profile, which leads to variations in the masses and springs. Other previous work has demonstrated a mirror [3] using Si DRIE and ARDE to form a 100 µm-thick bulk Si mass with approximately 5µm thickness variation. Process variations such as thickness variation and beam width variation cause changes of the masses, spring constants, and consequently resonant frequencies.…”

Section: Introductionmentioning

confidence: 99%

“…-(3). Using the NODAS model, the gradient parameters inside the variation matrix J in(2)are determined and chosen based on the sensitivity of the displacement of mass m 1 with respect to Δt o , Δt x and Δw.…”

mentioning

confidence: 99%

SI-CMOS-MEMS dual mass resonator for extracting mass and spring variations

Fang

Mukherjee

Fedder

2013

2013 IEEE 26th International Conference on Micro Electro Mechanical Systems (MEMS)

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This paper presents Si-CMOS-MEMS dual mass resonators (DMRs) which are fabricated using Si-CMOS-MEMS technology for extracting mass and spring variations. The CMOS chip is fabricated in BiCMOS 0.35 µm process from Jazz Semiconductor. 0.2 µm flatness of the backside silicon over 1.5 mm distance is achieved. The Si-CMOS-MEMS DMR includes proof masses, serpentine spring suspensions and comb fingers and serves as the basic structure for a z-axis differential gimbaled gyroscope. The DMR enables the extraction of process variations by comparing measured frequency response with a geometrically parameterized system-level simulation of the DMR. A model-based methodology is proposed to extract mass and spring variations. Three parameters including in-phase displacement, anti-phase displacement and the difference in displacement between two proof masses in anti-phase mode are chosen to extract the geometrical process variation parameters. The variation between the dual masses is approximately 1.2-1.5% and the spring variation is 3.1%.

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“…Wu et al demonstrated a 4 × 4 electrothermal bimorph-based TTP MMA [15], in which each subaperture is 0.5 mm × 0.5 mm in size and can achieve ±30 • optical deflection and a maximum 215-μm piston stroke, all at less than 5 V. The fill factor of this device in the MMA region is 31%. Gilgunn et al presented a 3 × 3 silicon-oninsulator-complementary metal-oxide-semiconductor-MEMS (SOI-CMOS-MEMS) electrothermal MMA with bimorph actuators [16]. The device achieved an area fill factor of 95%, with each element size of 1.0 mm × 1.0 mm.…”

mentioning

confidence: 98%

“…More importantly, to integrate the SCS mirror plate with the comb-drive actuators or electrodes, one or more dedicated bonding steps or trench-filling and chemical-mechanicalpolishing (CMP) steps are required, which make the fabrication complicated, costly, and low yield [11]- [13]. Electrothermally actuated TTP MMAs have also been reported, based on either thermal bimorph actuators [15], [16] or thermal-pneumatic actuators [17]. Thermal-pneumatic actuation usually has slow response and high power consumption.…”

mentioning

confidence: 99%

High-Fill-Factor Micromirror Array With Hidden Bimorph Actuators and Tip–Tilt-Piston Capability

Jia

Samuelson

Xie

2011

J. Microelectromech. Syst.

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This paper presents the design, fabrication, packaging, and characterization of a novel high-fill-factor micromirror array (MMA) actuated by electrothermal bimorphs. In this paper, 4 × 4 MMA devices with an 88% area fill factor at normal incidence, 1.5 mm × 1.5 mm subaperture size, and single-crystalsilicon-supported mirror plates have been fabricated based on a single silicon-on-insulator wafer, without additional bonding/ transfer processes. The bimorph actuators are hidden underneath the mirror plates, which are also protected by silicon walls. The MMA devices can directly be surface mounted onto driving circuit chips or printed circuit boards after fabrication. The subapertures can generate large tip-tilt-piston scanning and can individually be addressed. Static characterizations of the packaged devices show that each subaperture can achieve a piston stroke of ∼ 310 µm and optical deflection angles greater than ±25 • in both the x-and y-axes, all at 8-V dc. The preliminary laser-steering opticalphased-array capability of the obtained MMA device has also experimentally been demonstrated.Index Terms-Bimorph, flip-chip packaging, microelectromechanical systems (MEMS), micromirror, micromirror array (MMA), microoptoelectromechanical systems (MOEMS), optical phased array (OPA), surface mounting.

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Flip-Chip Integrated Soi-Cmos-Mems Fabrication Technology

Cited by 8 publications

References 11 publications

Theoretical and Experimental Demonstration on Grating Lobes of Liquid Crystal Optical Phased Array

Theoretical and Experimental Demonstration on Grating Lobes of Liquid Crystal Optical Phased Array

SI-CMOS-MEMS dual mass resonator for extracting mass and spring variations

High-Fill-Factor Micromirror Array With Hidden Bimorph Actuators and Tip–Tilt-Piston Capability

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