Abstract-A systematic design of practicable media suitable for re-writeable, ultra-high density (> 1Tbit/sq.in.), high data rate (> 1Mbit/s/tip) scanning probe phase-change memories is presented. The basic design requirements were met by a Si/TiN/GST/DLC structure, with properly tailored electrical and thermal conductivities. Various alternatives for providing re-writeability were investigated. In the first case amorphous marks were written into a crystalline starting phase and subsequently erased by re-crystallization, as in other already-established phasechange memory technologies. Results imply that this approach is also appropriate for probe-based memories. However, experimentally the successful writing of amorphous bits using scanning electrical probes has not been widely reported. In light of this a second approach has been studied, that of writing crystalline bits in an amorphous starting matrix, with subsequent erasure by re-amorphization. With conventional phase-change materials, such as continuous films of Ge 2 Sb 2 Te 5 , this approach invariably leads to the formation of a crystalline 'halo' surrounding the erased (re-amorphized) region, with severe adverse consequences on the achievable density. Suppression of the 'halo' was achieved using patterned media or slow-growth phase-change media, with the latter seemingly more viable.

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In this paper, the correlation between dislocation density and transistor leakage current is demonstrated. The stress evolution and the generation of defects are studied as a function of the process step, and experimental evidence is given of the role of structure geometry in determining the stress level and hence defect formation. Finally, the role of high-dose implantations and the related silicon amorphization and recrystallization is investigated.

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Secondary ion mass spectrometry characterization of source/drain junctions for strained silicon channel metal-oxide-semiconductor field-effect transistors

This paper presents a systematic investigation of thermal stability of high-k materials deposited on RCA cleaned wafers by ALCVD™ in an ASM Pulsar™ 2000 reactor. Physical-chemical evolution of Al2O3, HfO2 and Al/Hf composite materials (nanolaminate and aluminates) was studied considering two types of thermal treatments: quenched vacuum anneals from 300°C to 900°C and furnace atmospheric processes in N2 or O2 at 850°C and 900°C. Material crystallization and changes in film structure were studied by means of TEM, XRD, XRR, XRF, RBS and TOF-SIMS. Non-contact electrical measurements were used to detect modification in EOT and fixed charge. Al2O3 was found still amorphous at 900°C. Not so for HfO2 that crystallized in monoclinic phase at a temperature between 300–400°C. Crystallization temperature and possible phase separation of Al/Hf composite materials were found to be a function of Al2O3 content and film type. In most of these samples, however, a chemical evolution was detected in addition to the above reported crystallization phenomena. All the achieved results demonstrate that depending on thermal treatment conditions, ALCVD™ high-k stability does not only concern phase transition effects but also a transformation of the “SiO2/high-k” system into “doped-SiO2/silicate” stack.