Plastic reshaping is applied to different Si microelements. Because of the brittleness of Si at room temperature the process is performed at 900 • C. Microelements suitable for plastic reshaping are beams fastened at one side, stripes fastened at two sides, membranes and bars. Microelements were integrated into one wafer and fabricated by wet anisotropic etching. After this, in a testing machine equipped with a furnace, the reshaping process was carried out in different ways: (1) loading of elements in single chips with a silica rod or special tools and (2) simultaneous loading of all elements in the wafer (batch process) with special wafer tools. The tools (a stamp and a rest) were also fabricated by wet anisotropic etching. Using these tools very exact deformed shapes can be made, but the bend is limited by the depth/height of the tools. Very large bends can be realized by using the silica rod, but the exact positioning is difficult. Planned applications are a micro mirror with a slope of 45 • to the wafer plane, a clip-system and a guide through several wafers.
The process of contactless laser bending using the laser induced thermal stresses that up to this moment is performed with steels and other metal alloys is ®rstly applied to silicon microstructural elements. One-side-fastened Si beams prepared by anisotropic wet etching were locally heated by a Nd:YAG laser. The beams were bent without additional tools towards the incident laser beam. Bending angles up to 90°are realizable. The degree of bending is strongly dependent on the used laser parameters, the position of heating and the number and distance of the laser scans.
Es wird ein Silizium-Federsystem mit integriertem Anschlag vorgestellt, das sich als Maßverkörperung von Kraft und Weg zur Kalibrierung von Geräten der registrierenden Härteprüfung eignet. Nominalwerte von Anschlagsauslenkung und dazu notwendiger Kraft sind 25 μm bzw. 425 mN. Das Normal hat eine exakt lineare Charakteristik und besitzt einen Toleranzbereich für den Belastungsort von 0.5 mm Durchmesser.
For the traceability of hardness and elasticity measurements with instrumented indenters to SI units, a measuring standard based on a silicon bending spring with a stop limit exists. Besides the bending stiffness of the spring, the bending point of the measured force–displacement curve at the stop limit can be used as an additional calibration point for both the probing force and the displacement. In a round-robin test with six participants and seven devices the bending stiffness, the bending force and the bending deflection were measured and compared. The result of the bending stiffness, the bending force and the bending deflection agree within ±2.8 %, ±4.2 % and ±3.2 %, respectively.
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