Plastic reshaping is applied to different Si microelements. Because of the brittleness of Si at room temperature the process is performed at 900 • C. Microelements suitable for plastic reshaping are beams fastened at one side, stripes fastened at two sides, membranes and bars. Microelements were integrated into one wafer and fabricated by wet anisotropic etching. After this, in a testing machine equipped with a furnace, the reshaping process was carried out in different ways: (1) loading of elements in single chips with a silica rod or special tools and (2) simultaneous loading of all elements in the wafer (batch process) with special wafer tools. The tools (a stamp and a rest) were also fabricated by wet anisotropic etching. Using these tools very exact deformed shapes can be made, but the bend is limited by the depth/height of the tools. Very large bends can be realized by using the silica rod, but the exact positioning is difficult. Planned applications are a micro mirror with a slope of 45 • to the wafer plane, a clip-system and a guide through several wafers.
The plastic reshaping is applied to Si microstructures prepared by wet anisotropic etching. The performed processes are the deformation in a furnace with tools also prepared from Si and the laser beaming. The generation of dislocations necessary for the plastic deformation of the monocrystalline dislocation free material and the bending fracture strength of undeformed and deformed Si are investigated. Demonstrators for possible applications are presented.
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.