Plastic reshaping of silicon microstructures: process, characterization and application

Abstract

The plastic reshaping is applied to Si microstructures prepared by wet anisotropic etching. The performed processes are the deformation in a furnace with tools also prepared from Si and the laser beaming. The generation of dislocations necessary for the plastic deformation of the monocrystalline dislocation free material and the bending fracture strength of undeformed and deformed Si are investigated. Demonstrators for possible applications are presented.

Design optimization of bistable modules electrothermally actuated for digital microrobotics

“…Noting that the thermal actuator design is always acceptable when the maximal temperature is far from 650 • C, the temperature of plastic reshaping of silicon microstructures [17].…”