Mounting of Si-Chips with Plastically Bent Cantilevers

Gärtner, Eva; Frühauf, Joachim; Hannemann, Birgit; Jänsch, E.

doi:10.1007/978-3-642-59497-7_48

Cited by 6 publications

(2 citation statements)

References 6 publications

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“…At the end a clip-chip mechanism first shown in [16] and done there with the help of a mechanical tool now is bended with the laser beam as tool. The possibility to mount components like chips with this method is shown in Fig.…”

Section: Examples For Laser Bended Msementioning

confidence: 99%

Contactless laser bending of silicon microstructures

Exner

Löschner

2003

SPIE Proceedings

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We are going to present a new technology for laser bending of silicon microstructures based upon a suggestion of and carried out in cooperation with Prof. Dr. J. Frühauf from the Technical University Chemnitz (see acknowledgement).We investigated the influence of various laser process parameters on the bending angle and its reproducibility. Bending of the silicon element as a result of the laser induced thermal stresses in the material occurs toward the incident laser beam. The bending angle depends on a lot of laser process and material parameters. In particular we found that the irradiation regime is well suited to control the bending angle. First substantial FEM based calculations of laser induced temperature fields using a moving laser heat source show the temperature field propagation in the material and reveal some regions of complicated overheating. As a result of our experiments we show a variety of examples including multiple and also continuous bendings.There are several essential advantages compared to conventional bending technologies with this new method: Laser bending is contactless without using additional tools or external forces. Because of the local laser treatment the heat flux to the neighbouring material is minimized. The laser beam can be applied through windows of glass that means to almost hermetically sealed micro devices. So laser technology is suitable for machining of already finished microsystems.It opens up a wide field of applications in micro system technologies: clip-chip-mechanism or sliding chips for micro optical benches, the adjustment of optical mirrors or other components or the ability of continuous bending for electrostatic drives and so on.

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Section: Examples For Laser Bended Msementioning

confidence: 99%

Contactless laser bending of silicon microstructures

Exner

Löschner

2003

SPIE Proceedings

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“…Plastically deformed polysilicon structures have also been used in a self-assembled MEMS process [14]. On a larger scale, silicon-chip-mounting using plastically deformed single-crystal-silicon cantilever beams has been demonstrated [15]. In our paper, self-aligned vertically interdigitated comb-sets are fabricated in a precisely controlled, repeatable batch process.…”

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confidence: 99%

Microfabricated Torsional Actuators Using Self-Aligned Plastic Deformation of Silicon

Kim

Choo

Lin

et al. 2006

J. Microelectromech. Syst.

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Abstract-In this paper, we describe angular vertical-combdrive torsional microactuators made in a new process that induces residual plastic deformation of single-crystal-silicon torsion bars. Critical dimensions of the vertically interdigitated moving-and fixed-comb actuators are self-aligned in the fabrication process and processed devices operate stably over a range of actuation voltages. We demonstrate MEMS scanning mirrors that resonate at 2.95 kHz and achieve optical scan angles up to 19.2 degrees with driving voltages of 40V dc plus 13V pp . After continuous testing of five billion cycles at the maximum scanning angle, we do not observe any signs of degradation in the plastically deformed silicon torsion bars.[1550]

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Technological Basis of Bulk-Silicon-Microtechnique

Shape and Functional Elements of the Bulk Silicon Microtechnique

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Mounting of Si-Chips with Plastically Bent Cantilevers

Cited by 6 publications

References 6 publications

Contactless laser bending of silicon microstructures

Contactless laser bending of silicon microstructures

Microfabricated Torsional Actuators Using Self-Aligned Plastic Deformation of Silicon

Technological Basis of Bulk-Silicon-Microtechnique

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