2001
DOI: 10.1007/s005420000065
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Laser bending of etched silicon microstructures

Abstract: The process of contactless laser bending using the laser induced thermal stresses that up to this moment is performed with steels and other metal alloys is ®rstly applied to silicon microstructural elements. One-side-fastened Si beams prepared by anisotropic wet etching were locally heated by a Nd:YAG laser. The beams were bent without additional tools towards the incident laser beam. Bending angles up to 90°are realizable. The degree of bending is strongly dependent on the used laser parameters, the position … Show more

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Cited by 25 publications
(11 citation statements)
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“…As the understanding of the process developed, more varied substrates were explored such as titanium, [27,73] and copper alloys [74,75], hoping to develop new ways to form 3D structures for aerospace and electrical applications. Researchers have also explored laser forming on non-metallic substrates and have bent typically brittle materials such as silicon [76][77][78], ceramics [41,79], and glass [79,80]. More recently, there have also been demonstrations of the laser forming of more complex structures, such as metal foams [81,82] and laminates [83].…”
Section: Laser and Substrate Selectionmentioning
confidence: 99%
“…As the understanding of the process developed, more varied substrates were explored such as titanium, [27,73] and copper alloys [74,75], hoping to develop new ways to form 3D structures for aerospace and electrical applications. Researchers have also explored laser forming on non-metallic substrates and have bent typically brittle materials such as silicon [76][77][78], ceramics [41,79], and glass [79,80]. More recently, there have also been demonstrations of the laser forming of more complex structures, such as metal foams [81,82] and laminates [83].…”
Section: Laser and Substrate Selectionmentioning
confidence: 99%
“…Dearden et al [3] described a number of new techniques in laser bending for macro-and micro-scale applications. Gartner et al [4] realized the highest precision deformation of silicon microstructures using laser bending technology. Zhang et al [5] described a laser based technique to adjust curvatures of silicon micro-cantilevers used for chemical and biological detection.…”
Section: Introductionmentioning
confidence: 99%
“…Thus, this process may be useful for forming brittle materials that is easy to fracture by tensile stress and very strong against compressive stress. There are a lot of reports about forming sheets of carbon steel, stainless steel (1) , aluminum alloy (2), (3) , titanium alloy (4) and plastics, these are all ductile material, however, a few researches are performed about forming brittle materials, silicon and glass, by laser forming process (5), (6) . If laser beam is irradiated to thin film metallic glasses, it is considerable that those materials are heated up and become ductile and easy to form plastically.…”
Section: Introductionmentioning
confidence: 99%