There was an error published in J. Cell Sci. 120, 1317-1323.We apologise for two errors that occurred in the online and pdf versions of this article. The printed version is correct.On p. 1317, in the Summary, the sentence 'Formation of GW bodies appears to depend on both specific protein factors and RNA, in particular, microRNA.' appeared twice. The correct version of the summary is shown below. Summary GW bodies, also known as mammalian P-bodies, are cytoplasmic foci involved in the post-transcriptional regulation of eukaryotic gene expression. Recently, GW bodies have been linked to RNA interference and demonstrated to be important for short-interfering-RNA-and microRNA-mediated mRNA decay and translational repression. Evidence indicates that both passenger and guide strands of short-interfering RNA duplexes can localize to GW bodies, thereby indicating that RNA-induced silencing complexes may be activated within these cytoplasmic centers. Work over the past few years has significantly increased our understanding of the biology of GW bodies, revealing that they are specialized cell components that spatially regulate mRNA turnover in various biological processes. Formation of GW bodies appears to depend on both specific protein factors and RNA, in particular, microRNA. Here, we propose a working model for GW body assembly in terms of its relationship to RNA interference. In this process, one or more heteromeric protein complexes accumulate in successive steps into larger ribonucleoprotein structures.On p. 1319, right column, first paragraph, the word order of the penultimate sentence was incorrect and should read:In particular, studies in Drosophila indicate that GW182 interacts with Ago1 and promotes miRNA-mediated degradation of a subset of mRNA targets (Behm-Ansmant et al., 2006).
Moisture-related failure is one of the main concerns in the integrated circuit (IC) package design. To minimize such failure in multi-layered electronic assemblies and packages, it is important to develop a better understanding of the reliability at a molecular level. In this paper, molecular dynamics (MD) simulations were conducted to investigate the respective moisture diffusion into the epoxy molding compound (EMC) and at the EMC/Cu interface. Moisture diffusion coefficients into the bulk EMC material and at the EMC/Cu interface can be derived from the mean-squared displacements calculated from MD simulations. The MD results showed that the seepage along the EMC/Cu interface is more prevalent when compared to moisture diffusion into the bulk EMC and, thus, rendering it a dominant mechanism causing moisture induced interfacial delamination in plastic packages.
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