Moisture Diffusion Study in Electronic Packaging using Molecular Dynamic Simulation

Fan, Haichao; Chan, E.K.L.; Wong, Chi-Yin; Yuen, M.M.F.

doi:10.1109/ectc.2006.1645843

Cited by 17 publications

(7 citation statements)

References 8 publications

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“…Mean square displacement was used to calculate the diffusion coefficient of the system by taking the slope of the line achieved from the diffusion trajectories of the simulation [21]. The diffusion coefficient was also calculated to analyse the system aggregation and viscous regime.…”

Section: Mean Square Displacementmentioning

confidence: 99%

Simulation and experimental study of rheological properties of CeO2–water nanofluid

2014

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Metal oxide nanoparticles offer great merits over controlling rheological, thermal, chemical and physical properties of solutions. The effectiveness of a nanoparticle to modify the properties of a fluid depends on its diffusive properties with respect to the fluid. In this study, rheological properties of aqueous fluids (i.e. water) were enhanced with the addition of CeO 2 nanoparticles. This study was characterized by the outcomes of simulation and experimental results of nanofluids. The movement of nanoparticles in the fluidic media was simulated by a largescale molecular thermal dynamic program (i.e. LAMMPS). The COMPASS force field was employed with smoothed particle hydrodynamic potential (SPH) and discrete particle dynamics potential (DPD). However, this study develops the understanding of how the rheological properties are affected due to the addition of nanoparticles in a fluid and the way DPD and SPH can be used for accurately estimating the rheological properties with Brownian effect. The rheological results of the simulation were confirmed by the convergence of the stress autocorrelation function, whereas experimental properties were measured using a rheometer. These rheological values of simulation were obtained and agreed within 5 % of the experimental values; they were identified and treated with a number of iterations and experimental tests. The results of the experiment and simulation show that 10 % CeO 2 nanoparticles dispersion in water has a viscosity of 2.0-3.3 mPas.

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Section: Mean Square Displacementmentioning

confidence: 99%

Simulation and experimental study of rheological properties of CeO2–water nanofluid

2014

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“…Furthermore, it seems that the interface adhesion is a function of exposure time to moisture and the adhesion strength decreases as the moisture content increases [44,45]. Finally, the moisture diffusion coefficient at the EMC/leadframe interface is larger (almost one order magnitude) than that in the bulk EMC which may be due to the large pore sizes at the EMC/ leadframe interface than those within the bulk EMC and also capillary diffusion along the EMC/leadframe interface [46,47]. However, it is very difficult to characterize the interfacial diffusion coefficient.…”

Section: Variation Of Stress Intensity Factor and Strain Energy Releamentioning

confidence: 95%

Interface delamination analysis of TQFP package during solder reflow

Rossi

Luan

et al. 2010

Microelectronics Reliability

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“…Molecular dynamics (MD) techniques increase in popularity for polymeric materials, carbon nanotubes,rings, -connectors etc. [8], to simulate and understand the moisture diffusion [9], the mechanical behavior and properties of certain bi-material interfaces [10] and to determine material properties [11]. Two major ways seem to satisfy the need for characterizing the underlying physics best and to close the gap between MDandFEM:…”

Section: Multi-scale Modeling -Structural Demandsmentioning

confidence: 99%

Crack and damage evaluation in low-k BEoL stacks under chip package interaction aspects

Auersperg

Vogel

Lehr³

et al. 2009

EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelect

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The electronic industry drive for miniaturization and increasing functional integration forces the development of feature sizes down to the nanometer range. Moreover, harsh environmental conditions and new porous or nano-particle filled materials introduced on both chip and package level - low-k and ultra low-k ILD materials in Back-End of Line (BEoL) layers of advanced CMOS technologies, in particular - cause new challenges for reliability analysis and prediction. The authors show a combined numerical/experimental way and results towards optimized fracture resistance of those structures under chip package interaction aspects utilizing integral bulk and interface fracture concepts, VCCT and cohesive zone models in multi-scale and multi-failure modeling approaches with several kinds of imperfections. As important preconditions for high-quality simulations, nano-indentation AFM, FIB and EBSD provide the desired properties, while FIB-based trench techniques using deformation analyses by grayscale correlation and numerical simulations provide the intrinsic stresses especially of thin films in BEoL layers

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Moisture Diffusion Study in Electronic Packaging using Molecular Dynamic Simulation

Cited by 17 publications

References 8 publications

Simulation and experimental study of rheological properties of CeO2–water nanofluid

Simulation and experimental study of rheological properties of CeO2–water nanofluid

Interface delamination analysis of TQFP package during solder reflow

Crack and damage evaluation in low-k BEoL stacks under chip package interaction aspects

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