Interface delamination analysis of TQFP package during solder reflow

Hu, Guojun; Rossi, Roberto; Luan, Jing-en; Baraton, Xavier

doi:10.1016/j.microrel.2010.03.012

Cited by 20 publications

(4 citation statements)

References 42 publications

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“…Molding materials for semiconductor packaging must possess strong adhesiveness to prevent delamination owing to the stress produced in environmental testing. [37,38] In particular, the adhesiveness to Si and Cu, which are commonly used for lead frames and wiring, is an essential property for semiconductor package molding materials. In addition, because organic materials are prone to thermal decomposition, their properties may deteriorate after long-term storage at high temperatures.…”

Section: Adhesion Propertiesmentioning

confidence: 99%

Maleimide Resin Blends with Enhanced Toughness for High-Temperature Semiconductor Packaging

Kikuchi

Karasawa

Watanabe

et al. 2021

Transactions of The Japan Institute of Electronics Packaging

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Highly heat-resistant molding materials are required for manufacturing power modules. We investigated a sheet molding material where a blend of rigid and flexible maleimide resins (MA and MB, respectively) offer high heat resistance and toughness enhancement for wide-bandgap semiconductor packaging applications. We found that the MB formulation with 30% by weight of the maleimide resin enhanced toughness of the maleimide resin blend. This formulation passed −55/200°C package-level temperature cycle tests without compromising the heat resistance. We also found that the maleimide resin blend exhibited a strong adhesion strength to Cu foil (7.3 N•cm −1 ). This performance maintained even after thermal storage at 200°C for 1,000 h. We think that the developed sheet molding material can be used for hightemperature-operating power modules manufactured with fan-out panel-level packaging.

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Section: Adhesion Propertiesmentioning

confidence: 99%

Maleimide Resin Blends with Enhanced Toughness for High-Temperature Semiconductor Packaging

Kikuchi

Karasawa

Watanabe

et al. 2021

Transactions of The Japan Institute of Electronics Packaging

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“…Moisture diffuses from the package's exterior surfaces into the MC. Fick's second law can be applied to describe the moisture diffusion process in polymer materials [10]. For the isotropic material, ∂C/∂t=D (∂ 2 C/∂x 2 +∂ 2 C/∂y 2 +∂ 2 C/∂z 2 ) (1) Where D is the diffusion coefficient, C is the moisture concentration, x, y and z is Cartesian coordinates, and t is the time.…”

Section: Theoretical Analysismentioning

confidence: 99%

Research on Delamination of Plastic Packaging Device during Reflow Soldering

Liu

Huang

et al. 2015

KEM

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Due to the application of lead-free solders, the quality and reliability of plastic packaging device are influenced by the increase of reflow temperature. In this paper, a low-profile quad flat package (LQFP) is chosen to illustrate the interface deformation during reflow soldering. The stress analysis theory and the finite element analysis (FEM) simulation are introduced in this paper. By means of finite element software, the distribution of hygrostress, thermal stress and the deformation of device on the printed circuit board (PCB) are analyzed and calculated under different temperature. The relationship between delamination length and deformation is given. The simulation results show that the warping phenomenon is found at the apex angle of the device; delamination is easily produced in the interfaces between different materials by thermal stress, and possibly leads to the device failure.

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“…First of all, the reasonable simplification for the physical model should be executed to obtain the thermal simulation model. In the paper, the following specific model simplifications have be done to establish the finite element model of thermal simulation [5][6]: A side is only BGA component, and B side is mini-size chip components.…”

Section: Design Of Simulating Model and Process Parametersmentioning

confidence: 99%