No abstract

2004) Synthesis of block co-polymers and star-branched polymers consisting of conducting polyacetylene segments via ionic interaction to form ionic bonds, Designed Monomers and Polymers, 7:6, 647-660To link to this article: http://dx.Abstract-Chain-end-and in-chain-functionalized poly(phenyl vinyl sulfoxide) with a definite number of dimethylamino groups have been synthesized by living anionic polymerization of phenyl vinyl sulfoxide with functionalized initiators prepared from either 1-(4-dimethylaminophenyl)-1-phenylethylene or 1,1-bis(4-dimethylaminophenyl)ethylene with carbanionic species such as secBuLi, cumylpotassium and potassium naphthalenide. By the stoichiometric reaction of the dimethylamine-chain-functionalized poly(phenyl vinyl sulfoxide) thus prepared with ω-carboxylated polystyrene and subsequent thermal treatment of the reaction mixture, novel block co-polymer and asymmetric star-branched polymers consisting of conducting polyacetylene (PA) and polystyrene segments via ionic interaction to form ionic bonds have been synthesized. The lamellar morphologies with conducting PA layers were observed in the cast films of such block co-polymer and star-branched polymer.

No abstract

No abstract

Highly heat-resistant molding materials are required for manufacturing power modules. We investigated a sheet molding material where a blend of rigid and flexible maleimide resins (MA and MB, respectively) offer high heat resistance and toughness enhancement for wide-bandgap semiconductor packaging applications. We found that the MB formulation with 30% by weight of the maleimide resin enhanced toughness of the maleimide resin blend. This formulation passed −55/200°C package-level temperature cycle tests without compromising the heat resistance. We also found that the maleimide resin blend exhibited a strong adhesion strength to Cu foil (7.3 N•cm −1 ). This performance maintained even after thermal storage at 200°C for 1,000 h. We think that the developed sheet molding material can be used for hightemperature-operating power modules manufactured with fan-out panel-level packaging.