Highly heat-resistant molding materials are required for manufacturing power modules. We investigated a sheet molding material where a blend of rigid and flexible maleimide resins (MA and MB, respectively) offer high heat resistance and toughness enhancement for wide-bandgap semiconductor packaging applications. We found that the MB formulation with 30% by weight of the maleimide resin enhanced toughness of the maleimide resin blend. This formulation passed −55/200°C package-level temperature cycle tests without compromising the heat resistance. We also found that the maleimide resin blend exhibited a strong adhesion strength to Cu foil (7.3 N•cm −1 ). This performance maintained even after thermal storage at 200°C for 1,000 h. We think that the developed sheet molding material can be used for hightemperature-operating power modules manufactured with fan-out panel-level packaging.
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.