Vertical junction resonant microdisk modulators and switches have been demonstrated with exceptionally low power consumption, low-voltage operation, high-speed, and compact size. This paper reviews the progress of vertical junction microdisk modulators, provides detailed design data, and compares vertical junction performance to lateral junction performance. The use of a vertical junction maximizes the overlap of the depletion region with the optical mode thereby minimizing both the drive voltage and power consumption of a depletion-mode modulator. Further, the vertical junction enables contact to be made from the interior of the resonator and therein a hard outer wall to be formed that minimizes radiation in small diameter resonators, further reducing the capacitance and drive power of the modulator. Initial simple vertical junction modulators using depletion-mode operation demonstrated the first sub-100 fJ/bit silicon modulators. With more intricate doping schemes and through the use of AC-coupled drive signals, 3.5 μm diameter vertical junction microdisk modulators have recently achieved a communications efficiency of 3 fJ/bit, making these modulators the smallest and lowest power modulators demonstrated to date, in any material system. Additionally, the demonstration was performed at 12.5 Gb/s, required a peak-to-peak signal level of only 1 V, and achieved bit-error-rates below 10(-12) without requiring signal pre-emphasis. As an additional benefit to the use of interior contacts, higher-order active filters can be constructed from multiple vertical-junction modulators without interference of the electrodes. Doing so, we demonstrated second-order active high-speed bandpass switches with ~2.5 ns switching speeds, and power penalties of only 0.4 dB. Through the use of vertical junctions in resonant modulators, we have achieved the lowest power consumption, lowest voltage, and smallest silicon modulators demonstrated to date.

In this Letter, we propose and demonstrate a high-speed and power-efficient thermo-optic switch using an adiabatic bend with a directly integrated silicon heater to minimize the heat capacity and therein maximize the performance of the thermo-optic switch. A rapid, τ=2.4 μs thermal time constant and a low electrical power consumption of P(π)=12.7 mW/π-phase shift were demonstrated representing a P(π)τ product of only 30.5 mW·μs in a compact device with a phase shifter of only ~10 μm long.

We demonstrate an ultra-high-bandwidth Mach-Zehnder electro-optic modulator (EOM), based on foundry-fabricated silicon (Si) photonics, made using conventional lithography and wafer-scale fabrication, oxide-bonded at 200C to a lithium niobate (LN) thin film. Our design integrates silicon photonics light input/output and optical components, such as directional couplers and low-radius bends. No etching or patterning of the thin film LN is required. This hybrid Si-LN MZM achieves beyond 106 GHz 3-dB electrical modulation bandwidth, the highest of any silicon photonic or lithium niobate (phase) modulator.

Photonic integrated circuits (PICs) provide a compact and stable platform for quantum photonics.Here we demonstrate a silicon photonics quantum key distribution (QKD) transmitter in the first high-speed polarization-based QKD field tests. The systems reach composable secret key rates of 950 kbps in a local test (on a 103.6-m fiber with a total emulated loss of 9.2 dB) and 106 kbps in an intercity metropolitan test (on a 43-km fiber with 16.4 dB loss). Our results represent the highest secret key generation rate for polarization-based QKD experiments at a standard telecom wavelength and demonstrate PICs as a promising, scalable resource for future formation of metropolitan quantum-secure communications networks.Quantum key distribution (QKD) remains the only quantum-resistant method of sending secret information at a distance [1,2]. The first QKD system ever devised used polarization of photons to encode information [3,4]. QKD has since progressed rapidly to several deployed systems that can reach point-to-point secret key generation rates in the upwards of 100 kbps [5][6][7][8] and to other photonic degrees of freedom: time [9][10][11][12], frequency [13][14][15][16], phase [17], quadrature [18][19][20][21], and orbital angular momentum [22]. While polarization remains an attractive choice for free-space QKD due to its robustness against turbulence [23][24][25][26][27][28], polarization is commonly thought to be unstable for fiber-based QKD. For this reason, there has been a strong interest in translating the polarization QKD components into photonic integrated circuits (PICs), which provide a compact and phase-stable platform capable of correcting for polarization drifts in the channel. Recently, silicon-based polarization QKD transmitters were used for laboratory QKD demonstrations [29,30], but their performance advantage over standard telecommunication components has yet to be demonstrated. Here we report the first field tests using high-speed silicon photonics-based transmitter for polarization-encoded QKD.The silicon photonics platform allows for the integration of multiple high-speed photonic operations into a single compact circuit [31][32][33][34]. Operating at gigahertz bandwidth, a silicon photonics polarization QKD transmitter can correct for polarization drifts with typical millisecond time scales in a metropolitan-scale fiber link. Furthermore, silicon nanophotonic devices are compatible with the existing complementary metal-oxidesemiconductor (CMOS) processes that have enabled monolithic integration of photonics and electronics, possibly leading to future widespread utilization of QKD.The QKD transmitter demonstrated here is manufactured using a CMOS-compatible process. The trans-mitter combines a 10-Gbps Mach-Zehnder Modulator (MZM) with interleaved grating couplers, which convert the polarization of a photon in an optical fiber into the path the photon takes in the integrated circuit, and vice versa. The high-speed polarization control is enabled by electro-optic carrier depletion modulation withi...

We present a compact 1.3 × 4 μm2 Germanium waveguide photodiode, integrated in a CMOS compatible silicon photonics process flow. This photodiode has a best-in-class 3 dB cutoff frequency of 45 GHz, responsivity of 0.8 A/W and dark current of 3 nA. The low intrinsic capacitance of this device may enable the elimination of transimpedance amplifiers in future optical data communication receivers, creating ultra low power consumption optical communications.