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An unprecedented 3D hetero‐triple‐walled metal‐organic framework is obtained by straightforward elaboration of the mixed molecular building block (MBB) strategy. In this approach, multiple individual flexible and rigid MBBs are integrated into one composite building block as separate layers, which are of the same shape but different sizes. This MOF shows exceptional water stability and the application of Li‐ion battery electrodes.

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This paper introduced the preparation of butylene fipronil-loaded microcapsules with oppositely charged chitosan and sodium lignosulfonate as shell materials. It summed up the performance, preparation methods of microcapsules and sketched the application status of layer-by-layer self-assembly. The whole progress of the preparation was controlled by measuring the change of the Zeta potential and the morphology of microcapsules was characterized by microscope and SEM. Entrapment efficiency and slow release performance of the microcapsule were determined as measurement index. The results of experiment showed that the surface of the microcapsules was rougher than the butylene fipronil particles. With the increasing layer number of assembly, the entrapment efficiency reduced while the slow release performance increased. After encapsulation, the photodegradation rate of butylene fipronil under the UV decreased obviously. Results showed that the condition of preparation was the best when NaCl with the concentration of 0.5 mol/L and PH of 5.0.

Purpose The purpose of this paper is to study an electrolytic etching method to prepare fine lines on printed circuit board (PCB). And the influence of organics on the side corrosion protection of PCB fine lines during electrolytic etching is studied in detail. Design/methodology/approach In this paper, the etching factor of PCB fine lines produced by new method and the traditional method was analyzed by the metallographic microscope. In addition, field emission scanning electron microscopy (SEM) and X-ray photoelectron spectroscopy (XPS) were used to study the inhibition of undercut of the four organometallic corrosion inhibitors with 2,5-dimercapto-1,3,4-thiadiazole, benzotriazole, l-phenylalanine and l-tryptophan in the electrolytic etching process. Findings The SEM results show that corrosion inhibitors can greatly inhibit undercut of PCB fine lines during electrolytic etching process. XPS results indicate that N and S atoms on corrosion inhibitors can form covalent bonds with copper during electrolytic etching process, which can be adsorbed on sidewall of PCB fine lines to form a dense protective film, thereby inhibiting undercut of PCB fine lines. Quantum chemical calculations show that four corrosion inhibitor molecules tend to be parallel to copper surface and adsorb on copper surface in an optimal form. COMSOL Multiphysics simulation revealed that there is a significant difference in the amount of corrosion inhibitor adsorbed on sidewall of the fine line and the etching area. Originality/value As a clean production technology, electrolytic etching method has a good development indicator for the production of high-quality fine lines in PCB industry in the future. And it is of great significance in saving resources and reducing environmental pollution.