The effect of tricyclazole as a novel leveler for filling electroplated copper microvias

Liao, Chan; Zhang, Shengtao; Chen, Shijin; Qiang, Yujie; Liu, Gen; Tang, Mingxing; Tan, Bochuan; Fu, Denglin; Xu, Yue

doi:10.1016/j.jelechem.2018.08.042

Cited by 42 publications

(22 citation statements)

References 52 publications

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“…Although Δ E thiamine is greater than Δ E JGB , Δ E thiamine is less than some Δ E of leveling agents, such as Δ E tricyclazole is 6. 36 eV . Therefore, the energy gap of Δ E indicates that thiamine has an adsorption capacity.…”

Section: Resultsmentioning

confidence: 99%

Prediction and Effect Verification of Thiamine as a Leveling Agent in Chip Wafer Electroplating

Wei,

Tan,

Liu

et al. 2023

ACS Omega

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Section: Resultsmentioning

confidence: 99%

Prediction and Effect Verification of Thiamine as a Leveling Agent in Chip Wafer Electroplating

Wei,

Tan,

Liu

et al. 2023

ACS Omega

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“…The spread of corrosive agents on the electrode surface or the distribution of corrosion products in the solution results in W impedance. The W impedance was obliterated and the arc was enlarged by adding the NPT to the blank solution, representing the inhibitive film on the Cu surface prevented the dissemination of corrosion products to the bulk solution or the dispersion of Cl − onto the Cu surface (Liao et al , 2018). Table 1 demonstrates the electrochemical data attained from EIS measurement.…”

Section: Resultsmentioning

confidence: 99%

Investigation of corrosion inhibition of 4-(4-nitrophenyl) thiazol-2-amine on the copper in HCl: experimental and theoretical studies

Farahati

Ghaffarinejad

Mousavi-Khoshdel

2022

WJE

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Purpose This paper aims to investigate the corrosion inhibition ability of 4–(4-nitrophenyl) thiazol-2-amine (NPT) on the copper in 1 M HCl. Design/methodology/approach The corrosion inhibitory ability of NPT on the copper in 1 M HCl was studied by electrochemical impedance spectroscopy, scanning electron microscopy and atomic force microscopy. Theoretical calculations (molecular dynamics simulation, density functional theory and the nucleus independent chemical shift [NICS] as aromaticity indicator of the molecule) were also performed. Findings The corrosion inhibition efficacy of this compound was about 80%. Nyquist plots display a small arc contributed to the film or oxide layer resistance and a large loop associated with charge transfer resistance. The inhibitor adsorption was under Langmuir’s adsorption model. ΔG0ads values point to the presence of physical and chemical adsorption. Results of quantum chemical calculations showed that NPT has better interaction with copper than NPTH+. NICS of NPT in benzene or thiazole rings was less negative compared to NICS of NPTH+. Thus NPT shows less aromaticity compared with NPTH+, showing NPT can have better interaction with copper than NPTH+. NPT had more negative Eint value and more interactions with the Cu relative to NPTH+, this result was in agreement with the results of quantum chemical calculations. Originality/value NPT is an efficient corrosion inhibitor for copper in HCl. Theoretical calculations showed that NPT can have better interaction with copper than NPTH+. The results of the theoretical studies were in good agreement with the experimental studies.

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“…Figure 6 shows Cu2p3 spectrum of copper samples studied under different inhibitor conditions. The Cu2p3 spectra of copper samples decompose within binding energy range of 925–938 eV, and they can be deconvoluted into two components, which are generally copper oxides (Luo et al , 2018; Liao et al , 2018). What’s more, owing to acidic etching environment of electrolytic etchant, Cu(II) and Cu(I) are attributed to electrochemical and chemical corrosion during electrolytic etching (Modestov et al , 1995).…”

Section: Resultsmentioning

confidence: 99%

Study on fine lines and undercut suppression of printed circuit board prepared by electrolytic etching

Wen

Chen

et al. 2021

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Purpose The purpose of this paper is to study an electrolytic etching method to prepare fine lines on printed circuit board (PCB). And the influence of organics on the side corrosion protection of PCB fine lines during electrolytic etching is studied in detail. Design/methodology/approach In this paper, the etching factor of PCB fine lines produced by new method and the traditional method was analyzed by the metallographic microscope. In addition, field emission scanning electron microscopy (SEM) and X-ray photoelectron spectroscopy (XPS) were used to study the inhibition of undercut of the four organometallic corrosion inhibitors with 2,5-dimercapto-1,3,4-thiadiazole, benzotriazole, l-phenylalanine and l-tryptophan in the electrolytic etching process. Findings The SEM results show that corrosion inhibitors can greatly inhibit undercut of PCB fine lines during electrolytic etching process. XPS results indicate that N and S atoms on corrosion inhibitors can form covalent bonds with copper during electrolytic etching process, which can be adsorbed on sidewall of PCB fine lines to form a dense protective film, thereby inhibiting undercut of PCB fine lines. Quantum chemical calculations show that four corrosion inhibitor molecules tend to be parallel to copper surface and adsorb on copper surface in an optimal form. COMSOL Multiphysics simulation revealed that there is a significant difference in the amount of corrosion inhibitor adsorbed on sidewall of the fine line and the etching area. Originality/value As a clean production technology, electrolytic etching method has a good development indicator for the production of high-quality fine lines in PCB industry in the future. And it is of great significance in saving resources and reducing environmental pollution.

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The effect of tricyclazole as a novel leveler for filling electroplated copper microvias

Cited by 42 publications

References 52 publications

Prediction and Effect Verification of Thiamine as a Leveling Agent in Chip Wafer Electroplating

Prediction and Effect Verification of Thiamine as a Leveling Agent in Chip Wafer Electroplating

Investigation of corrosion inhibition of 4-(4-nitrophenyl) thiazol-2-amine on the copper in HCl: experimental and theoretical studies

Study on fine lines and undercut suppression of printed circuit board prepared by electrolytic etching

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