Honokiol (HNK), the main active component of Magnolia officinalis, has shown a variety of pharmacological activities. In the present study, we measured the antidepressant-like effects of HNK in a rat model of chronic unpredictable mild stress (CUMS) and explored its possible mechanisms. The antidepressant-like effects of HNK were assessed in rats by an open field test (OFT), sucrose preference test (SPT) and forced swimming test (FST). Then, serum levels of corticotrophin-releasing hormone (CRH), adrenocorticotropic hormone (ACTH) and corticosterone (CORT) and hippocampal brain-derived neurotrophic factor (BDNF) and glucocorticoid receptor α (GRα) levels were assessed to explore the possible mechanisms. We identified that HNK treatment (2, 4, and 8 mg/kg) alleviated the CUMS-induced behavioural deficits. Treatment with HNK also normalized the CUMS-induced hyperactivity of the limbic hypothalamic-pituitary-adrenal (HPA) axis, as indicated by reduced CRH, ACTH and CORT serum levels. In addition, HNK increased the expression of GRα (mRNA and protein) and BDNF (mRNA and protein) in the hippocampus. These data confirmed the antidepressant-like effects of HNK, which may be related to its normalizing the function of the HPA axis and increasing the BDNF level in the hippocampus.
Aqueous potassium-ion hybrid supercapacitors (APHS) are one of the promising technology for energy storage due to it combine the advantages of potassium-ion batteries and supercapacitors, which can provide high energy...
Purpose
This paper aims to propose a modified full-additive method (MFAM) to fabricate fine copper lines for high density interconnection (HDI) printed circuit boards (PCBs). In addition, the surface of the fine copper lines is treated with a brown oxidation process to obtain good adhesion between the copper and the dielectric resin.
Design/methodology/approach
Fine copper lines fabricated by MFAM were observed to evaluate the undercut quality, in comparison to undercut quality of copper lines fabricated by the semi-additive method and the subtractive method. The effect of the thickness of the dry film on the quality of the copper plating was investigated to obtain the regular shape of fine lines. The fine copper lines treated with the brown oxidation process were also examined to generate a coarse surface microstructure to improve the adhesion between the copper and the dielectric resin. The cross section and surface of as-fabricated fine copper lines were characterized using an optical microscope, a scanning electron microscope and an atomic force microscope.
Findings
MFAM has the potential to fabricate high-performance fine copper lines for HDI PCBs. Undercut of as-fabricated fine copper lines could be prevented to meet the design requirement of impedance. In addition, fine copper lines exhibit enough adhesive force to laminate with dielectric resin after the brown oxidation process.
Originality/value
MFAM, with the advantages of high efficiency and being a facile process, is developed to fabricate high-quality fine copper lines for industrial HDI PCB manufacture.
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