Abstract-Electrochemical migration behavior of end terminals on ceramic chip resistors (CCRs) was studied using a novel experimental setup in varying sodium chloride concentrations from 0 to 1000 ppm. The chip resistor used for the investigation was 10-kΩ CCR size 0805 with end terminals made of 97Sn3Pb alloy. Anodic polarization behavior of the electrode materials was investigated using a microelectrochemical setup. Material makeup of the chip resistor was investigated using scanning electron microscopy (SEM)/energy dispersive spectroscopy and focused-ion-beam SEM. Results showed that the dissolution rate of the Sn and stability of Sn ions in the solution layer play a significant role in the formation of dendrites, which is controlled by chloride concentration and potential bias. Morphology, composition, and resistance of the dendrites were dependent on chloride concentration and potential.
In this paper, we present a route for making smart functionalized plastic parts by injection molding with sub-micrometer surface structures. The method is based on combining planar processes well known and established within silicon micro and sub-micro fabrication with proven high resolution and high fidelity with truly freeform injection molding inserts. The link between the planar processes and the freeform shaped injection molding inserts is enabled by the use of nanoimprint with flexible molds for the pattern definition combined with unidirectional sputter etching for transferring the pattern. With this approach, we demonstrate the transfer of down to 140 nm wide holes on large areas with good structure fidelity on an injection molding steel insert. The durability of the sub-micrometer structures on the inserts have been investigated by running two production series of 102,000 and 73,000 injection molded parts, respectively, on two different inserts and inspecting the inserts before and after the production series and the molded parts during the production series.
This work presents device level testing of a lead free soldered electronic device tested with bias on under cyclic humidity conditions in a climatic chamber. Besides severe temperature and humidity during testing some devices were deliberately contaminated before testing. Contaminants investigated are ionic or airborne contaminants likely to be introduced by production or service conditions. The effect of changes in processing parameters as a result of production shift to lead free solder (e.g. higher soldering temperature) has also been investigated. Analysis have shown that one printed circuit board assembly (PCBA) in the device is more prone to corrosion reliability and this was further analysed using thermography to detect areas that have high risk of condensation due to lower temperature under working condition. Tested PCBAs are subjected to detailed investigation before and after testing using high resolution photography, detailed optical microscopy and SEM/EDS.
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