Corrosion in Electronics at Device Level

Jellesen, Morten Stendahl; Minzari, Daniel; Rathinavelu, Umadevi; Møller, Per; Ambat, Rajan

doi:10.1149/1.3321952

Cited by 32 publications

(8 citation statements)

References 5 publications

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“…Flux residues are usually corrosive and favorable for some steps of ECM because they are usually composed of ionic substances 44,46,[137][138][139][140][141][142][143][144][145][146] and other species. The most common ionic substances in ux residues are weak organic acids, or halogenides such as chlorides.…”

Section: Flux Residuesmentioning

confidence: 99%

Electrochemical migration of Sn and Sn solder alloys: a review

et al. 2017

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Sn and Sn solder alloys in microelectronics are the most susceptible to suffer from electrochemical migration (ECM) which significantly compromises the reliability of electronics. This topic has attracted more and more attention from researchers since the miniaturization of electronics and the explosive increase in their usage have largely increased the risk of ECM. This article first presents an introductory overview of the ECM basic processes including electrolyte layer formation, dissolution of metal, ion transport and deposition of metal ions. Then, the article provides the major development in the field of ECM of Sn and Sn solder alloys in recent decades, including the recent advances and discoveries, current debates and significant gaps. The reactions at the anode and cathode, the mechanisms of precipitates formation and dendrites growth are summarized. The influencing factors including alloy elements (Pb, Ag, Cu, Zn, etc.), contaminants (chlorides, sulfates, flux residues, etc.) and electric field (bias voltage and spacing) on the ECM of Sn and Sn alloys are highlighted. In addition, the possible strategies such as alloy elements, inhibitor and pulsed or AC voltage for the inhibition of the ECM of Sn and Sn solder alloys have also been reviewed.

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Section: Flux Residuesmentioning

confidence: 99%

Electrochemical migration of Sn and Sn solder alloys: a review

et al. 2017

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“…Critical humidity levels of some of the common ionic contaminations found on PCBA surfaces have been reported for example 84% for glutaric acid, 75% for NaCl, 29% for CaCl2, and only 11% for LiCl [50]. Recently, number of papers [2][3][4][5][6] have reported corrosion failure due to contamination on PCBAs, and especially from NaCl.…”

Section: Discussionmentioning

confidence: 99%

“…[1]. Material combinations on the PCBA, contamination, applied bias, and water film cause leak current, electrochemical migration, and other corrosion failure modes [2][3][4][5][6]. Therefore, regulating the humidity transfer between exterior and interior of the device is an important factor in reducing the risk of humidity related failures in electronics.…”

Section: Introductionmentioning

confidence: 99%

Humidity Buildup in Electronic Enclosures Exposed to Constant Conditions

Conseil-Gudla

Staliulionis

Jellesen

et al. 2017

IEEE Trans. Compon., Packag. Manufact. Technol.

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Electronic components and devices are exposed to a wide variety of climatic conditions, therefore the protection of electronic devices from humidity is becoming a critical factor in the system design. The ingress of moisture into typical electronic enclosures has been studied with defined parameters such as openings in the enclosure (drain holes, intentional openings or leak), and sealing and casing material. Related corrosion reliability issues due to humidity build-up have been evaluated using an interdigitated surface insulation resistance (SIR) pattern placed inside the enclosure during exposure. The moisture build-up inside the enclosure has been simulated using an equivalent RC circuit consisting of variables like controlled resistors and capacitors to describe the diffusivity, permeability, and storage in polymers.

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“…Further research efforts are needed on new polymer nanocomposite designs for green and sustainable electronic systems. 85…”

Section: Anticorrosion Polymeric Nanocomposite Applicationsmentioning

confidence: 99%

Corrosion prevention prospects of polymeric nanocomposites: A review

Kausar

2018

Journal of Plastic Film & Sheeting

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Corrosion is a serious problem for implementing metallic components and devices in industrial zones. Considerable effort has been made to develop corrosion prevention strategies. Initially, paints, pigments, and organic coatings have been applied to prevent metal corrosion. Consequently, conjugated polymers, epoxy resin, phenolics, acrylic polymers, and many thermoplastics as well as thermoset resins have been used to inhibit corrosion. Lately, nanofillers such as fullerene, nanodiamond, graphene, graphene oxide, carbon nanotube, carbon black, nanoclay, and inorganic nanoparticle have been introduced in polymeric matrices to harness valuable corrosion protection properties of the nanocomposite. Corrosion protection performance of a nanocomposite depends on nanofiller dispersion, physical and covalent interaction between matrix/nanofiller and nanofiller adhesion to the substrate. Moreover, a high performance anti-corrosion nanocomposite must have good barrier properties, and high scratch, impact, abrasion, and chemical resistance. Thus, polymeric nanocomposites have been found to prevent corrosion in aerospace and aircraft structural parts, electronic components, bipolar plates in fuel cells, and biomedical devices and systems. However, numerous challenges need to be addressed in this field to attain superior corrosion resistant nanocomposites. Future research on polymer nanocomposites has the potential to resolve the current challenges of metal corrosion through entire replacement of metal-based materials with advanced nanomaterials.

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Corrosion in Electronics at Device Level

Cited by 32 publications

References 5 publications

Electrochemical migration of Sn and Sn solder alloys: a review

Electrochemical migration of Sn and Sn solder alloys: a review

Humidity Buildup in Electronic Enclosures Exposed to Constant Conditions

Corrosion prevention prospects of polymeric nanocomposites: A review

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