1 Abstract-Research and optimisation of cooling of electronic components using heat sinks becomes increasingly important in modern industry. Numerical methods with experimental realworld verification are the main tools to evaluate efficiency of heat sinks or heat sink systems. Here the investigation of relatively simple heat sink application is performed using modelling based on finite element method, and also the potential of such analysis was demonstrated by real-world measurements and comparing obtained results. Thermal modelling was accomplished using finite element analysis software COMSOL and thermo-imaging camera was used to measure the thermal field distribution. Ideas for future research involving improvement of the experimental setup and modelling verification are given.Index Terms-Finite Element Method, heat sinks, temperature measurement.
With increasing complexity of electronic components and their systems, their cooling solutions become an important issue, and heat sinks are the most widely applied solution in industry. Theoretical, experimental and numerical methods can be used to determine a heat sinks thermal performance. Finite element method is probably the most suitable numerical technique to simulate thermal fields of heat sinks. The advantages of finite element modelling and analysis of heat sinks are discussed. Thermal modelling of heat sink mounted inside air channel was accomplished using finite element analysis software COMSOL. Algorithm for heat sink model building was offered. Finite element mesh generation and problem solution performance was evaluated using created algorithm. Performance evaluation results are presented.Index Terms-Finite element method, heat sink, automated modelling.
Electronic components and devices are exposed to a wide variety of climatic conditions, therefore the protection of electronic devices from humidity is becoming a critical factor in the system design. The ingress of moisture into typical electronic enclosures has been studied with defined parameters such as openings in the enclosure (drain holes, intentional openings or leak), and sealing and casing material. Related corrosion reliability issues due to humidity build-up have been evaluated using an interdigitated surface insulation resistance (SIR) pattern placed inside the enclosure during exposure. The moisture build-up inside the enclosure has been simulated using an equivalent RC circuit consisting of variables like controlled resistors and capacitors to describe the diffusivity, permeability, and storage in polymers.
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