Investigation of Heat Sink Efficiency for Electronic Component Cooling Applications

Abstract

1 Abstract-Research and optimisation of cooling of electronic components using heat sinks becomes increasingly important in modern industry. Numerical methods with experimental realworld verification are the main tools to evaluate efficiency of heat sinks or heat sink systems. Here the investigation of relatively simple heat sink application is performed using modelling based on finite element method, and also the potential of such analysis was demonstrated by real-world measurements and comparing obtained results. Thermal modelling was accomplished using finite element analysis software COMSOL and thermo-imaging camera was used to measure the thermal field distribution. Ideas for future research involving improvement of the experimental setup and modelling verification are given.Index Terms-Finite Element Method, heat sinks, temperature measurement.

Parametric Study of Uniform Heat Sink Design

“…The area for heat dissipation from the heat sink for the circular shape is given by Eq. (9). Similar expressions are given below for the ellipsoidal and squared shapes, under fixed volume condition.…”

“…Heat sinks [1][2][3][4][5][6][7][8][9][10] are devices used in high power systems to remove large amount of heat generated by its components [7]. A heat sink is used to increase the surface area which dissipates the heat faster and keeps the components under safe operating temperature ranges according to the manufacturer specifications [7].…”

“…Their performance and optimization were based on simulation. The use of high-power light emitting diodes (HP-LED) for public illumination is an emerging subject, triggered by recent developments of different technologies including semiconductor materials [5][6][7][8], fluorescence techniques [9], driver electronics [10] or thermal control [11] among others including concentrated solar cells [12][13][14][15].…”

“…For high power density as was highlighted in [9], thermal management is very essential especially in systems with all components including capacitors, inductors and semiconductor devices. These components used in power converters have maximum operating temperatures defined by the manufacturer.…”

Development of Prototype System for Regulating Thermal Conditions of Telecommunications Equipment Cabinets

“…Исследование и разработка устройств защиты радиоэлектронных систем от перегрева, создание отличительно новых конструкций термостабилизации, которые соотвествуют нестандартным требованиям, оптимизация массогабаритных и энергетических характеристикпредставляют собой набор ключевых задач, которые необходимо решать еще на стадии проектирования [11][12][13]. Температурный режим, связанный с отводом теплоты от радиоэлектронных устройств в замкнутом объеме является основополагающим фактором, отвечающим за надежность функционирования устройств, приборов и систем [14][15][16].…”