On the electrochemical migration mechanism of tin in electronics

Minzari, Daniel; Jellesen, Morten Stendahl; Møller, Per; Ambat, Rajan

doi:10.1016/j.corsci.2011.06.015

Cited by 99 publications

(115 citation statements)

References 22 publications

Supporting

Mentioning

107

Contrasting

Unclassified

Order By: Relevance

“…Ion chromatography technique was used to chemically characterize the WS composition of the solutions and the results are summarized in Table II. As it was already observed in Verdingovas et al (2013) [49] and [50], ECM presents a bell-shape probability in relation to solution concentration. Solutions S1 and S2 are very similar in ionic chemical composition, which correspond to 52.8% and 54.5% of the total mass of particulate matter samples, respectively.…”

Section: Corrosion In Condensing Conditionssupporting

confidence: 74%

“…They authors also reported that at the highest level of contaminations no dendrites or tin hydroxides were observed likely due to a reduction in pH, which makes unfavorable their precipitations. The importance of pH in ECM was deeply investigated in [50] highlighting the role of convection within the droplet in dissolving hydroxides precipitates and metallic tin precipitation at the cathode, allowing the dendrites formations and triggering shorts between the conductive lines. …”

Section: Corrosion In Condensing Conditionsmentioning

confidence: 99%

See 1 more Smart Citation

On the Effects of Atmospheric Particles Contamination and Humidity on Tin Corrosion

D'Angelo

Verdingovas

Ferrero

et al. 2017

IEEE Trans. Device Mater. Relib.

View full text Add to dashboard Cite

Abstract-The effects of hygroscopic atmospheric particles are investigated in relation with corrosion of tin. Surface insulation resistance test boards were directly contaminated both with ambient particles sampled in the field at Milan (Italy) and with pure saline particles generated in the laboratory. An innovative particle deposition device was used to uniformly coat circular spots on to the test board surfaces. Deliquescence and crystallization of the water-soluble compounds were detected by observing the impedance response to varying relative humidity (RH) conditions with a gradual and continuous ramps. The effects of the adsorption/desorption kinetics and of the temperature on the deliquescence and crystallization relative humidity values were also investigated. Leakage current measurements at 5 V DC highlighted the ability of atmospheric particles to promote corrosion and electrochemical migration at RH levels far below condensing conditions (100% RH).

show abstract

Section: Corrosion In Condensing Conditionssupporting

confidence: 74%

Section: Corrosion In Condensing Conditionsmentioning

confidence: 99%

On the Effects of Atmospheric Particles Contamination and Humidity on Tin Corrosion

D'Angelo

Verdingovas

Ferrero

et al. 2017

IEEE Trans. Device Mater. Relib.

View full text Add to dashboard Cite

show abstract

“…A considerable number of studies have investigated the suppression of ECM, with the aim of preventing electronic device failure (Minzari et al, 2011 andZhong et al, 2013), and these studies have reported that the precipitation grows as dendrites (Krumbein, 1988, Liu et al, 2011and Medgyes et al, 2016. Attempts have also been made to exploit precipitation because ECM is a low-cost and green fabrication technique in which the reaction is caused simply by DC voltage and water without any metal salts or hydroxides (Nakajima et al, 2015).…”

Section: Introductionmentioning

confidence: 99%

Enhanced fabrication of hybrid Cu-Cu<sub>2</sub>O nanostructures on electrodes using electrochemical migration

Fukaya

Aoki

Kimura

et al. 2018

Mechanical Engineering Letters

View full text Add to dashboard Cite

Cu, Cu2O and CuO nanostructures have characteristic physical properties, and are used in a variety of fields such as lithium ion batteries, solar batteries and gas sensors. Recently, various techniques for the nanostructures fabrication have been studied for these applications. It has been reported that electrochemical migration (ECM) causes insulation deterioration on the printed circuit boards in high-humidity and high-temperature conditions. Previous investigations of the suppression of ECM revealed that eluted Cu ions grew as dendrites. A considerable number of studies have investigated the suppression of ECM, but the beneficial use of ECM has not been studied extensively. The use of ECM has become the subject of increasing interest because ECM is a low-cost and green fabrication technique, and the reaction requires only DC voltage and water without any metal salts and hydroxides. Some attempts have been made to fabricate hybrid Cu-Cu2O nanostructures using ECM. However, it has been reported that the growth of dendrites between electrodes ceases because the dendrites create a shortcircuit. Thus, proper fabrication has not yet been achieved. This study aimed to enhance the fabrication of hybrid Cu-Cu2O nanostructures using ECM. In this study, we changed the path length of the dendrites' growth, and improved the fabrication process through evaluation of the results.

show abstract

“…Many types of metals that are widely used in the electronics have relevant ability for ECM, such as tin, silver or copper [2]. Next to Ag, Cu and Sn are also widely studied from the ECM point of view [2][3][4][5][6][7][8][9][10].…”

Section: Introductionmentioning

confidence: 99%

“…The electrochemical corrosion and ECM tests of Cu and Sn were usually investigated in bulk solutions [2,4,6,10,15]. On the other hand, the importance of thin electrolyte layer (TEL) tests are growing [16,17], hence ECM susceptibility depends also on the thickness of water layer [18].…”

Section: Introductionmentioning

confidence: 99%