Electrochemical migration of Cu and Sn in Na2SO4 environment

Medgyes, Bálint; Szabó, Péter Jánoš; Tamasi, Patrik; Gal, Laszlo; Harsányi, Gábor

doi:10.1109/isse.2016.7563195

Cited by 4 publications

(2 citation statements)

References 22 publications

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“…Only a precipitate is formed. However, when the concentration is increased beyond a certain point, dendritic growth occurs again with increasing risk of a short circuit [14][15][16][17][18].…”

Section: Introductionmentioning

confidence: 99%

Effect of Conformal Coating on Electrochemical Migration Behavior of Multi-Layer Ceramic Capacitor for Automotives Based on Water Drop Test

Yoo,

Won,

Kim

2024

Coatings

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A large amount of multi-layer ceramic capacitor (MLCC) is mounted inside a printed circuit board (PCB) constituting electronic components. The use of MLCC in electric vehicles and the latest mobile phones is rapidly increasing with the latest technology. Environments in which electronic components are used are becoming more diverse and conformal coatings are being applied to protect mounted components from these environments. In particular, MLCCs in electronic components mainly have voltage applied. They might be used in environments where humidity exists for various reasons. In a humid environment, electrochemical migration (ECM) will occur, with the cathode and anode on the surface of the MLCC encountering each other. This can result in product damage due to a short circuit. In this study, the effects of voltage, NaCl concentration, and distance between electrodes on a non-mount MLCC, surface mount MLCC, and solder pad pattern were evaluated using a water drop test (WDT). Based on the analysis of the effects of the presence of conformal coating, applied voltage, concentration of NaCl, and the distance between electrodes, a mechanism model for ECM behavior in MLCCs was proposed.

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Section: Introductionmentioning

confidence: 99%

Effect of Conformal Coating on Electrochemical Migration Behavior of Multi-Layer Ceramic Capacitor for Automotives Based on Water Drop Test

Yoo,

Won,

Kim

2024

Coatings

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show abstract

“…A considerable number of studies have investigated the suppression of ECM, with the aim of preventing electronic device failure (Minzari et al, 2011 andZhong et al, 2013), and these studies have reported that the precipitation grows as dendrites (Krumbein, 1988, Liu et al, 2011and Medgyes et al, 2016. Attempts have also been made to exploit precipitation because ECM is a low-cost and green fabrication technique in which the reaction is caused simply by DC voltage and water without any metal salts or hydroxides (Nakajima et al, 2015).…”

Section: Introductionmentioning

confidence: 99%

Enhanced fabrication of hybrid Cu-Cu<sub>2</sub>O nanostructures on electrodes using electrochemical migration

Fukaya

Aoki

Kimura

et al. 2018

Mechanical Engineering Letters

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Cu, Cu2O and CuO nanostructures have characteristic physical properties, and are used in a variety of fields such as lithium ion batteries, solar batteries and gas sensors. Recently, various techniques for the nanostructures fabrication have been studied for these applications. It has been reported that electrochemical migration (ECM) causes insulation deterioration on the printed circuit boards in high-humidity and high-temperature conditions. Previous investigations of the suppression of ECM revealed that eluted Cu ions grew as dendrites. A considerable number of studies have investigated the suppression of ECM, but the beneficial use of ECM has not been studied extensively. The use of ECM has become the subject of increasing interest because ECM is a low-cost and green fabrication technique, and the reaction requires only DC voltage and water without any metal salts and hydroxides. Some attempts have been made to fabricate hybrid Cu-Cu2O nanostructures using ECM. However, it has been reported that the growth of dendrites between electrodes ceases because the dendrites create a shortcircuit. Thus, proper fabrication has not yet been achieved. This study aimed to enhance the fabrication of hybrid Cu-Cu2O nanostructures using ECM. In this study, we changed the path length of the dendrites' growth, and improved the fabrication process through evaluation of the results.

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Electrochemical migration behavior of Sn–3.0Ag–0.5Cu solder alloy under SO2 polluted thin electrolyte layers

Liao

Cai

et al. 2019

J Mater Sci: Mater Electron

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Electrochemical migration of Cu and Sn in Na2SO4 environment

Cited by 4 publications

References 22 publications

Effect of Conformal Coating on Electrochemical Migration Behavior of Multi-Layer Ceramic Capacitor for Automotives Based on Water Drop Test

Effect of Conformal Coating on Electrochemical Migration Behavior of Multi-Layer Ceramic Capacitor for Automotives Based on Water Drop Test

Enhanced fabrication of hybrid Cu-Cu<sub>2</sub>O nanostructures on electrodes using electrochemical migration

Electrochemical migration behavior of Sn–3.0Ag–0.5Cu solder alloy under SO2 polluted thin electrolyte layers

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