Corrosion failure due to flux residues in an electronic add-on device

Jellesen, Morten Stendahl; Minzari, Daniel; Rathinavelu, Umadevi; Møller, Per; Ambat, Rajan

doi:10.1016/j.engfailanal.2010.02.010

Cited by 62 publications

(28 citation statements)

References 6 publications

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“…Flux residues are usually corrosive and favorable for some steps of ECM because they are usually composed of ionic substances 44,46,[137][138][139][140][141][142][143][144][145][146] and other species. The most common ionic substances in ux residues are weak organic acids, or halogenides such as chlorides.…”

Section: Flux Residuesmentioning

confidence: 99%

Electrochemical migration of Sn and Sn solder alloys: a review

et al. 2017

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Sn and Sn solder alloys in microelectronics are the most susceptible to suffer from electrochemical migration (ECM) which significantly compromises the reliability of electronics. This topic has attracted more and more attention from researchers since the miniaturization of electronics and the explosive increase in their usage have largely increased the risk of ECM. This article first presents an introductory overview of the ECM basic processes including electrolyte layer formation, dissolution of metal, ion transport and deposition of metal ions. Then, the article provides the major development in the field of ECM of Sn and Sn solder alloys in recent decades, including the recent advances and discoveries, current debates and significant gaps. The reactions at the anode and cathode, the mechanisms of precipitates formation and dendrites growth are summarized. The influencing factors including alloy elements (Pb, Ag, Cu, Zn, etc.), contaminants (chlorides, sulfates, flux residues, etc.) and electric field (bias voltage and spacing) on the ECM of Sn and Sn alloys are highlighted. In addition, the possible strategies such as alloy elements, inhibitor and pulsed or AC voltage for the inhibition of the ECM of Sn and Sn solder alloys have also been reviewed.

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Section: Flux Residuesmentioning

confidence: 99%

Electrochemical migration of Sn and Sn solder alloys: a review

et al. 2017

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“…The corrosion properties of Sn-based lead-free alloys in corrosive environments have not been widely reported, even though it is important in many automotive, aerospace, maritime and defense applications [10]. Corrosion mainly originates either within the circuit (flux corrosion) or from the environment [11,12].…”

Section: Corrosionmentioning

confidence: 99%

“…Aggressive ions, such as Cl − or Br − in flux, will increase the corrosion activities. Flux residue resin also accumulates dust during operation and later provides a hydrophilic surface which forms a medium for the ions to react with the solder materials [12,13]. Figure 1.…”

Section: Flux Corrosionmentioning

confidence: 99%

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Introductory Chapter: Overview of Recent Progress in Soldering Materials

Mohamad¹

2017

Recent Progress in Soldering Materials

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“…• C(90 s), peak: [19], the same flux type was applied in all cases. The applied test platform of WD tests can be seen in Fig.…”

Section: Methodsmentioning

confidence: 99%

Electrochemical Migration of Micro-alloyed Low Ag Solders in NaCl Solution

Medgyes

Illés

Harsányi

2013

Per. Pol. Elec. Eng.

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The reliability investigation of lead-free solders is still a current issue. In this paper, Electrochemical Migration (ECM) behaviour of novel lead-free micro-alloyed low Ag content solders was investigated by water drop test in IntroductionIn microelectronics industry, the applied solder materials are one of the most important factors related to the reliability of the products. According to the Restrictions of Hazardous Substances (RoHS) directive of European Union, lead bearing solders had to be replaced with lead-free ones [1]. In this context, alternative binary alloys had been examined as replacements for SnPb solders, such as near-eutectic SnAg, SnCu and SnZn alloys. However, ternaries (SnAgCu, SnZnAg, SnZnIn, etc.) and even quaternary alloys (SnZnAgAl, SnAgBiCu, SnInAgSb) had also been studied as candidates for lead-free solders [2][3][4][5][6][7].The reliability investigation of lead-free solders is still a current issue. One of the important reliability topics is the electrochemical migration (ECM) failure phenomenon. The common characteristics of the ECM phenomenon include the presence of moisture on conductor-dielectric-conductor systems under bias voltage, the electrochemical process and the metallic dendrite growth. This process is driven by the applied electric field from the anode to the cathode. Dendrite growth occurs as a result of metal ions being dissolved into a solution from the anode and deposited at the cathode, thereby growing in needle or tree-like formations. This effect causes short-circuits in electronic circuits, which may lead to a catastrophic failure.Many papers can be found about ECM investigations carried out on different lead-free solder alloys. Takemoto et al. have found that some tin based lead-free solder alloys are more resistant to ECM than Sn-Pb40 alloy and pure Indium. In-48Sn and In-50Pb alloys were found to be immune to ECM in high purity water [8]. Yu et al. have described that in Sn-37Pb and Sn-36Pb2Ag systems the main migration element is Pb, while in Sn-Ag and Sn-Ag-Cu solder alloys Sn leads the migration in high purity water [9,10].Other publication reported that SAC305 lead-free solder alloy has longer ECM lifetime in 0.001% NaCl solution than in 0.001% Na2SO4, since the passivity layer formed of SnO2 is thicker in the case of NaCl solution and Sn is the only element that contributes to ECM at room temperature [11]. The migration behaviour and the deposition process of Sn, Cu and Ag in case of SAC305 solder alloy were also observed in a thermal-

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Corrosion failure due to flux residues in an electronic add-on device

Cited by 62 publications

References 6 publications

Electrochemical migration of Sn and Sn solder alloys: a review

Electrochemical migration of Sn and Sn solder alloys: a review

Introductory Chapter: Overview of Recent Progress in Soldering Materials

Electrochemical Migration of Micro-alloyed Low Ag Solders in NaCl Solution

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