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Nanocrystalline metals are promising radiation tolerant materials due to their large interfacial volume fraction, but irradiation-induced grain growth can eventually degrade any improvement in radiation tolerance. Therefore, methods to limit grain growth and simultaneously improve the radiation tolerance of nanocrystalline metals are needed. Amorphous intergranular films are unique grain boundary structures that are predicted to have improved sink efficiencies due to their increased thickness and amorphous structure, while also improving grain size stability.In this study, ball milled nanocrystalline Cu-Zr alloys are heat treated to either have only ordered grain boundaries or to contain amorphous intergranular films distributed within the grain boundary network, and are then subjected to in situ transmission electron microscopy irradiation and ex situ irradiation. Differences in defect density and grain growth due to grain boundary complexion type are then investigated. When amorphous intergranular films are incorporated within the material, fewer and smaller defect clusters are observed while grain growth is also limited, leading to nanocrystalline alloys with improved radiation tolerance.

Building on the recent discovery of tough nanocrystalline Cu-Zr alloys with amorphous intergranular films, this paper investigates ternary nanocrystalline Cu-Zr-Hf alloys with a focus on understanding how alloy composition affects the formation of disordered complexions. Binary Cu-Zr and Cu-Hf alloys with similar initial grain sizes were also fabricated for comparison. The thermal stability of the nanocrystalline alloys was evaluated by annealing at 950 °C (>95% of the solidus temperatures), followed by detailed characterization of the grain boundary structure. All of the ternary alloys exhibited exceptional thermal stability comparable to that of the binary Cu-Zr alloy, and remained nanocrystalline even after two weeks of annealing at this extremely high temperature. Despite carbide formation and growth in these alloys during milling and annealing, the thermal stability of the ternary alloys is mainly attributed to the formation of thick amorphous intergranular films at high temperatures. Our results show that ternary alloy compositions have thicker boundary films compared to the binary alloys with similar global dopant concentrations.While it is not required for amorphous complexion formation, this work shows that having at least three elements present at the interface can lead to thicker grain boundary films, which is expected to maximize the previously reported toughening effect.

Amorphous complexions have recently been demonstrated to simultaneously enhance the ductility and stability of certain nanocrystalline alloys. In this study, three quinary alloys (Cu-Zr-Hf-Mo-Nb, Cu-Zr-Hf-Nb-Ti, and Cu-Zr-Hf-Mo-W) are studied to compare the influence of increased chemical complexity on thermal stability of the nanocrystalline microstructure, in addition to grain boundary structure. Significant boundary segregation is observed for Zr, Nb, and Ti in the Cu-Zr-Hf-Nb-Ti alloy, creating a quaternary interfacial composition which limits grain growth even after 1 week at ~97% of the melting temperature. This level of thermal stability is attributed to the high levels of chemical complexity at the grain boundary that is a consequence of the multi-component segregation. High resolution electron microscopy of grain boundary structure reveals that the complex grain boundary chemistry in the Cu-Zr-Hf-Nb-Ti alloy is associated with a 44% and 32% increase in the average amorphous complexion thicknesses found in previously studied Cu-Zr and Cu-Zr-Hf alloys.

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