In crystalline materials, plastic deformation occurs by the motion of dislocations, and the regions between individual crystallites, called grain boundaries, act as obstacles to dislocation motion. Grain boundaries are widely envisaged to be mechanically static structures, but this report outlines an experimental investigation of stress-driven grain boundary migration manifested as grain growth in nanocrystalline aluminum thin films. Specimens fabricated with specially designed stress and strain concentrators are used to uncover the relative importance of these parameters on grain growth. In contrast to traditional descriptions of grain boundaries as stationary obstacles to dislocation-based plasticity, the results of this study indicate that shear stresses drive grain boundaries to move in a manner consistent with recent molecular dynamics simulations and theoretical predictions of coupled grain boundary migration.

Sliding wear of nanocrystalline Ni-W alloys with grain sizes from 3 to 45 nm, a range which spans the transition in deformation mechanisms from intra-to intergranular, is studied through pin-on-disk wear testing. The extreme conditions produced during sliding wear are found to result in structural evolution and a deviation from Archard scaling for the finest grain sizes; in the finest nanocrystalline materials, wear resistance is higher than would be expected based on hardness alone. The repetitive sliding load is found to lead to a modest amount of grain growth and grain boundary relaxation, which in turn leads to local hardening in the wear track. Analysis of the dynamic microstructure suggests that it is produced primarily as a result of local plasticity, and is not principally due to frictional heating.

The control of interfaces in engineered nanostructured materials has met limited success compared with that which has evolved in natural materials, where hierarchical structures with distinct interfacial states are often found. Such interface control could mitigate common limitations of engineering nanomaterials. For example, nanostructured metals exhibit extremely high strength, but this benefit comes at the expense of other important properties like ductility. Here, we report a technique for combining nanostructuring with recent advances capable of tuning interface structure, a complementary materials design strategy that allows for unprecedented property combinations. Copper-based alloys with both grain sizes in the nanometre range and distinct grain boundary structural features are created, using segregating dopants and a processing route that favours the formation of amorphous intergranular films. The mechanical behaviour of these alloys shows that the trade-off between strength and ductility typically observed for metallic materials is successfully avoided here.

Nanocrystalline Cu-3 at.% Zr powders with ~20 nm average grain size were created with mechanical alloying and their thermal stability was studied from 550-950 °C. Annealing drove Zr segregation to the grain boundaries, which led to the formation of amorphous intergranular complexions at higher temperatures. Grain growth was retarded significantly, with 1 week of annealing at 950 °C, or 98% of the solidus temperature, only leading to coarsening of the average grain size to 54 nm. The enhanced thermal stability can be connected to both a reduction in grain boundary energy with doping as well as the precipitation of ZrC particles. High mechanical strength is retained even after these aggressive heat treatments, showing that complexion engineering may be a viable path toward the fabrication of bulk nanostructured materials with excellent properties.2

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Grain boundaries can undergo phase-like transitions, called complexion transitions, in which their structure, composition, and properties change discontinuously as temperature, bulk composition, and other parameters are varied. Grain boundary complexion transitions can lead to rapid changes in the macroscopic properties of polycrystalline metals and ceramics and are responsible for a variety of materials phenomena as diverse as activated sintering and liquid-metal embrittlement. The property changes caused by grain boundary complexion transitions can be beneficial or detrimental. Grain boundary complexion engineering exploits beneficial complexion transitions to improve the processing, properties, and performance of materials. Here, we review the thermodynamic fundamentals of grain boundary complexion transitions, highlight the strongest experimental and computationalevidence for these transitions, clarify a number of important misconceptions, discuss the advantages of grain boundary complexion engineering, and summarize existing research challenges.

HEAs’ compositional space allows the design of hierarchical microstructures that contribute to the exceptional strength values.

The hardening effect caused by the relaxation of nonequilibrium grain boundary structure has been explored in nanocrystalline Ni-W alloys. First, the kinetics of relaxation hardening are studied, showing that higher annealing temperatures result in faster, more pronounced strengthening. Based on the temperature dependence of relaxation strengthening kinetics, triple junction diffusion is suggested as a plausible kinetic rate limiter for the removal of excess grain boundary defects in these materials. Second, the magnitude of relaxation strengthening is explored over a wide range of grain sizes spanning the Hall-Petch breakdown, with an apparent maximum hardening effect found at a grain size below 10 nm. The apparent activation volume for plastic deformation is unaffected by annealing for grain sizes down to ;10 nm, but increases with annealing for the finest grain sizes, suggesting a change in the dominant deformation mechanism for these structures.