Damage during loading of polycrystalline metallic alloys is localized at or below the scale of individual grains. Quantitative assessment of the heterogeneous strain fields at the grain scale is necessary to understand the relationship between microstructure and elastic and plastic deformation. In the present study, digital image correlation (DIC) is used to measure the strains at the sub-grain level in a polycrystalline nickel-base superalloy where plasticity is localized into physical slip bands. Parameters to minimize noise given a set speckle pattern (introduced by chemical etching) when performing DIC in a scanning electron microscope (SEM) were adapted for measurements in both plastic and elastic regimes. A methodology for the optimization of the SEM and DIC parameters necessary for the minimization of the variability in strain measurements at high spatial resolutions is presented. The implications for detecting the early stages of damage development are discussed.

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High performance III-V lasers at datacom and telecom wavelengths on on-axis (001) Si are needed for scalable datacenter interconnect technologies. We demonstrate electrically injected quantum dot lasers grown on on-axis (001) Si patterned with {111} v-grooves lying in the [110] direction. No additional Ge buffers or substrate miscut was used. The active region consists of five InAs/InGaAs dot-in-a-well layers. We achieve continuous wave lasing with thresholds as low as 36 mA and operation up to 80°C.

High resolution scanning electron microscope digital image correlation (SEM DIC) was performed in situ during uniaxial loading on Ti-6Al-4V rolled sheet titanium to determine the dependence of strain localization on microstructure and microtexture. Individual grains with preferred orientation for basal slip exhibited plastic localization along basal planes before macroscopic yielding. With additional strain, but still below macroscopic yielding, pyramidal and prismatic plastic activity was observed as slip bands transmitting across many grains and entire microtextured regions (MTRs). The localization of long range plastic strain occurred within MTRs that allowed for slip transmission across grains with low angle boundaries. The rolled sheet titanium material having strong [0001] and [1010] texture components showed pyramidal and prismatic type slip extending across entire MTRs at strains well below macroscopic yielding. These strain localization processes occur much earlier in straining and over lengthscales much longer than observed with conventional slip offset imaging. The implications for properties are discussed.

In polycrystalline metallic materials, quantitative and statistical assessment of the plasticity in relation to the microstructure is necessary to understand the deformation processes during mechanical loading. Plastic deformation often localizes into physical slip bands at the sub-grain scale. Detrimental microstructural configurations that result in the formation and evolution of slip bands during loading require advanced strain mapping techniques for the identification of these atomically sharp discontinuities. A new discontinuity-tolerant DIC method, Heaviside-DIC, has been developed to account for discontinuities in the displacement field. Displacement fields have been measured at the scale of the physical slip bands over large areas in nickel-based superalloys by high resolution scanning electron microscopy digital image correlation (SEM DIC). However, conventional DIC methods cannot quantitatively measure plastic localization in the presence of discontinuous kinematic fields such as those produced by slip bands. The Heaviside-DIC technique can autonomously detect discontinuities, providing information about their location, inclination, and identify slip systems (in combination with orientation mapping). Using Heaviside-DIC, discontinuities are physically evaluated as sharp shear-localization events, allowing for the quantitative measure of strain amplitude nearby the discontinuities. Measurements using the new Heaviside-DIC technique are compared to conventional DIC methods for identical materials and imaging conditions.