Solution-processed
colloidal quantum dots (CQDs) are promising
materials for photodetectors operating in the short-wavelength infrared
region (SWIR). Devices typically rely on CQD-based hole transport
layers (HTL), such as CQDs treated using 1,2-ethanedithiol. Herein,
we find that these HTL materials exhibit low carrier mobility, limiting
the photodiode response speed. We develop instead inverted (p-i-n)
SWIR photodetectors operating at 1370 nm, employing NiOx as the HTL,
ultimately enabling 4× shorter fall times in photodiodes (∼800
ns for EDT and ∼200 ns for NiOx). Optoelectronic simulations
reveal that the high carrier mobility of NiOx enhances the electric
field in the active layer, decreasing the overall transport time and
increasing photodetector response time.
An alternative packaging method, termed built-in packaging, is proposed for single terminal devices, and demonstrated with an actuator application. Built-in packaging removes the requirements of wire bonding, chip carrier, PCB, probe station, interconnection elements, and even wires to drive single terminal devices. Reducing these needs simplifies operation and eliminates possible noise sources. A micro resonator device is fabricated and built-in packaged for demonstration with electrostatic actuation and optical measurement. Identical actuation performances are achieved with the most conventional packaging method, wire bonding. The proposed method offers a compact and cheap packaging for industrial and academic applications.
Engineering defects in titanium dioxide (TiO2) are becoming increasingly important to enhance its photocatalytic performance by increasing active sites and lowering its band gap from the UV towards the visible...
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