Built-In Packaging for Single Terminal Devices

Abstract

An alternative packaging method, termed built-in packaging, is proposed for single terminal devices, and demonstrated with an actuator application. Built-in packaging removes the requirements of wire bonding, chip carrier, PCB, probe station, interconnection elements, and even wires to drive single terminal devices. Reducing these needs simplifies operation and eliminates possible noise sources. A micro resonator device is fabricated and built-in packaged for demonstration with electrostatic actuation and optical measurement. Identical actuation performances are achieved with the most conventional packaging method, wire bonding. The proposed method offers a compact and cheap packaging for industrial and academic applications.

Built-In Packaging for Two-Terminal Devices

“…Building on our recent pioneering work on the built-in packaging of single-terminal devices [ 11 ], this study represents a significant advancement in two-terminal device packaging methodologies, explicitly focusing on MIM diodes and directly addressing the above challenges. We introduce an innovative approach to enhance diode performance and reliability that bypasses the limitations associated with traditional packaging.…”

“…In conclusion, our research highlights the potential of integrated packaging in two-terminal devices, presenting opportunities to enhance the efficiency, reliability, and cost-effectiveness of numerous applications. Our successful demonstration of the built-in packaging concept on both single-terminal [ 11 ], and two-terminal devices serve as a catalyst for further exploration of its applicability across diverse areas, including sensors, optics, RF, microfluidics, and other related applications.…”