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Баковец, В. В.; Levashova, T. M.; Dolgovesova, I. P.; Danilovich, V. S.

doi:10.1023/a:1015462820076

Cited by 12 publications

(9 citation statements)

References 6 publications

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“…A phenomenological model of coating stripping [78] can also be used to understand 12 various EPPs. Microdischarge evolution in the pores of oxide layers and oxide crystallisation phenomena during PEO processes have been discussed in [79][80][81].…”

Section: Model Classificationmentioning

confidence: 99%

“…The main problem with the latter approach lies in a lack of means to formalise the behaviours observed in experimental studies. For example, the descriptive phenomenology of microdischarges during PEO processes has not changed since 1990s [79] to 2000s [36] and to recent publications [88], but no general models quantitatively describing the process have been proposed yet. Therefore, the phenomenological approach pursued here includes two steps: a study of the generalised structure of the model and its numerical solution for selected EPPs using modern regression tools.…”

Section: Model Classificationmentioning

confidence: 99%

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Towards smart electrolytic plasma technologies: An overview of methodological approaches to process modelling

Парфенов

Yerokhin

Nev’yantseva

et al. 2015

Surface and Coatings Technology

155

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Article:Parfenov, E.V., Yerokhin, A., Nevyantseva, R. ReuseUnless indicated otherwise, fulltext items are protected by copyright with all rights reserved. The copyright exception in section 29 of the Copyright, Designs and Patents Act 1988 allows the making of a single copy solely for the purpose of non-commercial research or private study within the limits of fair dealing. The publisher or other rights-holder may allow further reproduction and re-use of this version -refer to the White Rose Research Online record for this item. Where records identify the publisher as the copyright holder, users can verify any specific terms of use on the publisher's website. TakedownIf you consider content in White Rose Research Online to be in breach of UK law, please notify us by emailing eprints@whiterose.ac.uk including the URL of the record and the reason for the withdrawal request. Abstract This paper reviews the present understanding of electrolytic plasma processes (EPPs) and approaches to their modelling. Based on the EPP type, characteristics and classification, it presents a generalised phenomenological model as the most appropriate one from the process diagnostics and control point of view. The model describes the system 'power supply -electrolyser -electrode surface' as a system with lumped parameters characterising integral properties of the surface layer and integral parameters of the EPP. The complexity of EPPs does not allow the drawing of a set of differential equations describing the treatment, although a model can be formalised for a particular process as a black box regression. Evaluation of dynamic properties reveals the multiscale nature of electrolytic plasma processes, which can be described by three time constants separated by 2-3 orders of magnitude (minutes, seconds and milliseconds), corresponding to different groups of characteristics in the model. Further developments based on the phenomenological approach and providing deeper insights into EPPs are proposed using frequency response methodology and electromagnetic field modelling. Examples demonstrating the efficiency of the proposed approach are supplied for EPP modelling with static and dynamic neural networks, frequency response evaluations and electromagnetic field calculations.

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Section: Model Classificationmentioning

confidence: 99%

Section: Model Classificationmentioning

confidence: 99%

Towards smart electrolytic plasma technologies: An overview of methodological approaches to process modelling

Парфенов

Yerokhin

Nev’yantseva

et al. 2015

Surface and Coatings Technology

155

View full text Add to dashboard Cite

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“…When the film thickness increases the scratches begin to disappear. Small coalesced clusters, 6 10 ±2 lm in diameter, appear at approximately 300 C, when the film thickness is 140 nm. The electron diffraction data listed in Table 1 are identified from the literature.…”

Section: Resultsmentioning

confidence: 99%

“…The nickel carbonyl, Ni(CO) 4 , precursor was mentioned many years ago. [4] Only a few other precursors, such as nickelocene, Ni(C 5 H 5 ) 2 [5] and its derivatives, bis(dimethylglyoximato)-Ni II , Ni(dmg) 2 , [6,7] and bis-N-(3-hydroxyimino-2-methylbutyl-2)-hydroxylamine Ni II , [8] are utilized today. Unlike Ni(CO) 4 , these precursors are air-stable and nontoxic.…”

Section: Introductionmentioning

confidence: 99%

Mechanism of Ni Film CVD with a Ni(ktfaa)₂ Precursor on a Copper Substrate

Баковец¹,

Митькин

Gelfond

2005

Chemical Vapor Deposition

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The mechanisms of pyrolysis in He and reduction in H 2 of a Ni(ktfaa) 2 chelate and nickel film deposition on copper substrates are discussed. The Ni films produced by CVD with the Ni(ktfaa) 2 chelate as a precursor are continuous. Pyrolysis of the Ni(ktfaa) 2 chelate takes place above 300 C. The hydrogen atmosphere allows the reaction temperature to be decreased to 213 C, but the film deposition rate is low. 300 C is the optimal temperature for continuous Ni film deposition on Cu substrates. The mechanism of hydrogen interaction with the adsorbed Ni(ktfaa) 2 chelate is discussed.

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“…The binding energies and the corresponding possible bond candidates for the fitted XPS spectra are summarized and listed in Table 1. [23][24][25][26][27][28][29][30][31][32][33] It should be mentioned that a constant value of 1.2 ± 0.1 eV was used for the full width at half maximum to fit all the O 1s and C 1s spectra in Figure 7.…”

Section: F I G U R E 4 Copper Film Deposition Rates At Different Discmentioning

confidence: 99%

Copper film deposition using a helium dielectric barrier discharge jet

Tsai

McIntyre

Burnette

et al. 2020

Plasma Processes & Polymers

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This study demonstrates that plasma-enhanced chemical vapor deposition of copper films can be achieved in ambient air and at low temperature. A helium dielectric barrier discharge jet with a small mixture of hydrogen and copper(II) acetylacetonate vapor is utilized as the nonthermal plasma source to deposit conductive copper films with low electrical resistivity (<1 × 10 −7 Ω•m). The deposited film appears to have three distinct regions (reddish brown, dark blue, and yellowish) from center to edge. Copper nanograins (~50 nm) are observed in both the reddish-brown and the dark-blue regions, whereas the yellowish region exhibits a continuous structure containing copper oxide. The copper films are further deposited on various temperature-sensitive substrates, including plastic, cardboard, agar, and pork skin. K E Y W O R D S atmospheric-pressure nonthermal plasma jet, copper(II) acetylacetonate, dielectric barrier discharge, plasma-enhanced chemical vapor deposition, thin films

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Untitled

Cited by 12 publications

References 6 publications

Towards smart electrolytic plasma technologies: An overview of methodological approaches to process modelling

Towards smart electrolytic plasma technologies: An overview of methodological approaches to process modelling

Mechanism of Ni Film CVD with a Ni(ktfaa)₂ Precursor on a Copper Substrate

Copper film deposition using a helium dielectric barrier discharge jet

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Untitled

Cited by 12 publications

References 6 publications

Towards smart electrolytic plasma technologies: An overview of methodological approaches to process modelling

Towards smart electrolytic plasma technologies: An overview of methodological approaches to process modelling

Mechanism of Ni Film CVD with a Ni(ktfaa)2 Precursor on a Copper Substrate

Copper film deposition using a helium dielectric barrier discharge jet

Contact Info

Product

Resources

About

Mechanism of Ni Film CVD with a Ni(ktfaa)₂ Precursor on a Copper Substrate