Copper film deposition using a helium dielectric barrier discharge jet

Tsai, Tsung-Chan; McIntyre, K. G.; Burnette, Matthew; Staack, David

doi:10.1002/ppap.201900251

Cited by 7 publications

(7 citation statements)

References 42 publications

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“…The SEM analysis shows that deposited films consist of uniformly packed large nanoparticles and agglomerates, which is typical for Cu‐containing deposits. [ 17,25 ]…”

Section: Resultsmentioning

confidence: 99%

“…The SEM analysis shows that deposited films consist of uniformly packed large nanoparticles and agglomerates, which is typical for Cu-containing deposits. [17,25] The thickness of films coated by spark and combined discharge sources was estimated by cracking the samples after 5 min of deposition and analysing the SEM image of the cross-sectional view. The deposition rate for spark discharge was about 6 nm/min, while for combined discharge, it is found to be 50 nm/min.…”

Section: Thin-film Characterizationmentioning

confidence: 99%

“…Various chemical substances, including metal‐containing compounds and organosilicon compounds both in solid and liquid form, can be applied as a precursor. For instance, Tsai et al [ 17 ] demonstrated the AP‐PECVD of copper films in ambient air and at a low temperature. A helium dielectric barrier discharge APP jet with a small mixture of hydrogen and copper(II) acetylacetonate vapour as a precursor was utilized as the non‐thermal plasma source to deposit conductive copper films.…”

Section: Introductionmentioning

confidence: 99%

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Thin‐film deposition by combining plasma jet with spark discharge source at atmospheric pressure

Ussenov

Toktamyssova

Dosbolayev

et al. 2020

Contributions to Plasma Physics

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This study demonstrates a method for the deposition of CuO x thin films by combining atmospheric pressure plasma jet with spark discharge. In this type of discharge source, the bulk copper material of spark discharge electrodes plays the role of a precursor. Copper atoms and particles go through the physical processes of sputtering, evaporation, and further agglomeration and condensation in the plasma jet and on the substrate. The experiments were carried out with and without a combination of discharges. The material coated on the substrate was studied using a scanning electron microscope, Raman spectroscopy, and energy-dispersive X-ray spectroscopy. The characteristics of the setup and plasma, such as I-V curves, optical emission spectra, and substrate temperature, were also measured. Copper electrodes were examined for erosion by a scanning electron microscope. The results demonstrate that deposits coated by combined discharge show denser and thicker films. K E Y W O R D S atmospheric pressure plasma jet, dielectric barrier discharge, low-temperature atmospheric-pressure plasma, spark discharge, thin film deposition

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“…The SEM analysis shows that deposited films consist of uniformly packed large nanoparticles and agglomerates, which is typical for Cu‐containing deposits. [ 17,25 ]…”

Section: Resultsmentioning

confidence: 99%

Section: Thin-film Characterizationmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Thin‐film deposition by combining plasma jet with spark discharge source at atmospheric pressure

Ussenov

Toktamyssova

Dosbolayev

et al. 2020

Contributions to Plasma Physics

View full text Add to dashboard Cite

show abstract

“…have studied a hybrid plasma system (plasma jet along with spark discharge) for the deposition of CuO x thin films. Further, Tsai et al [34] . have explored the properties of conductive Cu films prepared with AP‐PECVD He/H 2 plasma jet in ambient air from Cu(II) acetylacetonate vapor.…”

Section: Introductionmentioning

confidence: 99%

Synthesis of Transparent CuI Thin Films by a Facile Low‐Cost High Pressure (HP)‐PECVD Method at Room Temperature for the Application in Solar Cells

Sanyal Dipto,

Mondal,

Hossain

et al. 2023

ChemistryOpen

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Copper iodide (CuI) thin films were prepared on a glass substrate by a facile high pressure (HP)‐PECVD method at room temperature. For this, CuI powder was dissolved in CH3CN. The CuI vapor with plasma was investigated by Optical Emission Spectroscopic (OES) data for identifying the species in the plasma. The XRD study reveals the polycrystalline nature of the films. The SEM analyses indicate the homogeneity of the films. The EDS mapping confirms that the thin films mostly consisted of carbon followed by nitrogen, copper and iodine, respectively. The band gaps of CuI thin films were in the range of ~2.71–3.14 eV. The high transmittance and band gap engineering in HP‐PECVD‐synthesized CuI thin films indicates their potential use as window and hole transport layers in low cost solar cells.

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“…DBD plasmas are the best choice for a variety of industrial applications, including large scale ozone generation, odor removal, and material processing [ 4 , 5 ]. In addition, the potential of non-thermal DBD plasma systems for various medical and biological applications including wound healing, tissue regeneration, blood coagulation, tooth bleaching, and cancer treatment has been demonstrated [ 6 , 7 , 8 , 9 , 10 , 11 , 12 , 13 , 14 , 15 , 16 , 17 , 18 ]. In the midst of such applications, thin-film deposition using DBD plasmas presents several benefits compared to its vacuum counterparts in a variety of applications, such as film deposition on vacuum- or temperature-sensitive substrates and on biological/living surfaces [ 19 , 20 ].…”

Section: Introductionmentioning

confidence: 99%

Thin Film Deposition by Atmospheric Pressure Dielectric Barrier Discharges Containing Eugenol: Discharge and Coating Characterizations

et al. 2020

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Eugenol (4-Allyl-2-methoxyphenol) is the main constituent of clove oil. In addition to being widely used as a condiment, it has been recognized as a powerful bactericide. Owing to that, Eugenol has been used in several applications including odontology and as a conservative for food products. Aiming at the development of natural bactericide coatings, in this work, using an atmospheric pressure plasma in a dielectric barrier discharge (DBD) reactor Eugenol was deposited on stainless steel substrate, with argon as a carrier gas. The discharge power supply was a transformer at 14.4 kV peak-to-peak voltage and 60 Hz frequency. Operating with a gas flow rate at 4 L/min, the active power was around 1.2 W. The maximum plasma electron temperature of the plasma with monomers was about 1.5 eV, estimated by visible emission spectroscopy using a local thermodynamic equilibrium approach. The study also comprehended the analysis of the film structure, aging, and thermal stability using infrared reflectance spectroscopy, and its thicknesses and roughness by profilometry. The thickness of the films was in the range of 1000 to 2400 nm with a roughness of up to 800 nm with good adhesion on the substrate. The FTIR result shows a stable coating with a chemical structure similar to that of the monomer. Aging analysis showed that the film does not degrade, even after exposing the film for 120 days in ambient air and for 1.0 h under a high thermal UV-lamp.

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Copper film deposition using a helium dielectric barrier discharge jet

Cited by 7 publications

References 42 publications

Thin‐film deposition by combining plasma jet with spark discharge source at atmospheric pressure

Thin‐film deposition by combining plasma jet with spark discharge source at atmospheric pressure

Synthesis of Transparent CuI Thin Films by a Facile Low‐Cost High Pressure (HP)‐PECVD Method at Room Temperature for the Application in Solar Cells

Thin Film Deposition by Atmospheric Pressure Dielectric Barrier Discharges Containing Eugenol: Discharge and Coating Characterizations

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