Thin‐film deposition by combining plasma jet with spark discharge source at atmospheric pressure

Abstract

This study demonstrates a method for the deposition of CuO x thin films by combining atmospheric pressure plasma jet with spark discharge. In this type of discharge source, the bulk copper material of spark discharge electrodes plays the role of a precursor. Copper atoms and particles go through the physical processes of sputtering, evaporation, and further agglomeration and condensation in the plasma jet and on the substrate. The experiments were carried out with and without a combination of discharges. The material coated on the substrate was studied using a scanning electron microscope, Raman spectroscopy, and energy-dispersive X-ray spectroscopy. The characteristics of the setup and plasma, such as I-V curves, optical emission spectra, and substrate temperature, were also measured. Copper electrodes were examined for erosion by a scanning electron microscope. The results demonstrate that deposits coated by combined discharge show denser and thicker films. K E Y W O R D S atmospheric pressure plasma jet, dielectric barrier discharge, low-temperature atmospheric-pressure plasma, spark discharge, thin film deposition

Synthesis of Transparent CuI Thin Films by a Facile Low‐Cost High Pressure (HP)‐PECVD Method at Room Temperature for the Application in Solar Cells

“…The glow discharges possess uniform plasmas because of the absence of streamers that can be easily generated by reducing pressure for the deposition of uniform film. Recently, Ussenov et al [33] . have studied a hybrid plasma system (plasma jet along with spark discharge) for the deposition of CuO x thin films.…”

“…The glow discharges possess uniform plasmas because of the absence of streamers that can be easily generated by reducing pressure for the deposition of uniform film. Recently, Ussenov et al [33] have studied a hybrid plasma system (plasma jet along with spark discharge) for the deposition of CuO x thin films. Further, Tsai et al [34] have explored the properties of conductive Cu films prepared with AP-PECVD He/H 2 plasma jet in ambient air from Cu(II) acetylacetonate vapor.…”