1999
DOI: 10.1098/rsta.1999.0465
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X-ray topography and diffraction studies of misfit dislocation nucleation in Si-based structures

Abstract: The combination of different X-ray topography techniques and reciprocal space mapping is used to monitor the early stages of relaxation in silicon-based heterostructures. For lightly doped silicon layers grown on heavily boron-doped 150 mm substrates, Lang transmission topography demonstrates that an orthogonal array of 60 • misfits nucleates only at the wafer periphery. The length of the individual misfit segment depends on the epitaxial layer thickness and on the presence of the orthogonal blocking misfit se… Show more

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Cited by 19 publications
(14 citation statements)
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References 18 publications
(20 reference statements)
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“…Of course, the defects themselves may not be so large, but the distortions they create extend over length scales (tens of microns), far larger than the defects themselves. Similar concepts have been demonstrated in earlier studies on the misfit dislocations in Si using XRT . Note the presence of some orthogonal lines and circular features in Figure c, which are due to metallization on the sample surface.…”
Section: Resultssupporting
confidence: 86%
“…Of course, the defects themselves may not be so large, but the distortions they create extend over length scales (tens of microns), far larger than the defects themselves. Similar concepts have been demonstrated in earlier studies on the misfit dislocations in Si using XRT . Note the presence of some orthogonal lines and circular features in Figure c, which are due to metallization on the sample surface.…”
Section: Resultssupporting
confidence: 86%
“…[10] It is shown in Figure 2 that edge heterogeneous sources are the first to activate. This is consistent with previous experiments in SiGe/Si [14] and p/p + Si, [15] where a paucity of both substrate threading dislocations and interior heterogeneous sources existed.…”
Section: Resultssupporting
confidence: 93%
“…Метод Ланга особенно эффективен при изучении структурных дефектов в слабопоглощающих РЛ кристаллах. Он получил широкое распространение при характеризации реальной структуры монокристаллических пластин кремния, используемых в электронной промышленности для производства полупроводниковых микросхем (например, [41,[50][51][52] [56,57].…”
Section: метод лангаunclassified