X-ray diffraction as a tool to study the mechanical behaviour of thin films

Kraft, O.; Hommel, M.; Arzt, Eduard

doi:10.1016/s0921-5093(00)00876-5

Cited by 91 publications

(50 citation statements)

References 23 publications

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“…[1][2][3][4] These interconnect lines must deform with the substrate and survive strains greater than 10 pct while maintaining electrical conductivity. [1,2,5] Several studies have examined the tensile strength of blanket copper (Cu), aluminum, and gold films on polymer substrates [6][7][8][9][10][11] as well as gold lines. [4,12] Further research on ceramic coatings on polymers for barrier gas coatings has also been completed.…”

Section: Introductionmentioning

confidence: 99%

Fracture and Delamination of Chromium Thin Films on Polymer Substrates

Cordill

Taylor

Schalko

et al. 2009

Metall Mater Trans A

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New emerging technologies in the field of flexible electronic devices require that metal films adhere well and flex with polymer substrates. Common thin film materials used for these applications include copper (Cu) with an adhesion interlayer of chromium (Cr). Copper can be quite ductile and easily move with the polymer substrate. However, Cr is more brittle and fractures at lower strains than Cu. This study aims to examine the fracture and subsequent buckling and delamination of strained Cr films on polyimide (PI). In-situ scanning electron microscope (SEM) straining is used to systematically study the influence of film thickness on fracture and buckling strains. Film fracture and delamination depend on film thickness, and increases in crack and buckle density with decreasing thickness are explored by a shear lag model.

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Section: Introductionmentioning

confidence: 99%

Fracture and Delamination of Chromium Thin Films on Polymer Substrates

Cordill

Taylor

Schalko

et al. 2009

Metall Mater Trans A

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“…Independently from the applied technique of deposition in obtained thin films very large stresses develop during the process of deposition. Experiments have shown that the stress in thin metal films can exceed those of the corresponding bulk materials and increase with decreasing film thickness [3]. The physical properties of the film may be strongly influenced by stress in such films.…”

Section: Introductionmentioning

confidence: 99%

Evolution of stress and structure in Cu thin films

Chocyk

Zientarski

Prószyński

et al. 2005

Cryst. Res. Technol.

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Evolution of stresses developing in Cu thin films during and after deposition by thermal evaporation in UHV system is studied. Thin films were deposited on 100 µm thick Si substrate at room temperature. Deposition rates for the films were changed between 0.2 Å/s and 2.0 Å/s, while the total thickness was changed from 7.7 nm to 155 nm. Deformation analysis of crystalline lattice and microstructure was performed by x-ray diffraction measurements (θ-2θ scans, "sin 2 ψ" method). The surface morphology of film was studied by atomic force microscopy. The average stress in the films was determined by measuring the radius of curvature of samples. For thin films three stages of stress evolution (compressive, tensile and compressive) were we distinguished. This behavior is characteristic for materials with a Volmer-Weber mode. A three-dimensional molecular dynamics technique was applied for simulating the stress calculation during thin film growth. The results obtained from the simulation are consistent with the experimental results.

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“…Email: anderson.1@osu.edu has been used to study single-layer metallic films on substrates. [16][17][18][19] For Al [18] and Cu films [20] on Si substrates, it provides values of film stress comparable to those from curvature measurements. Despite this extensive work, in situ X-ray diffraction has not been reported for multilayers.…”

Section: Abstract: Nanolaminates X-ray Diffraction Interface Propermentioning

confidence: 72%