2018
DOI: 10.1109/tdmr.2018.2817341
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Wafer-Level Electrically Detected Magnetic Resonance: Magnetic Resonance in a Probing Station

Abstract: We report on a novel semiconductor reliability technique that incorporates an electrically detected magnetic resonance (EDMR) spectrometer within a conventional semiconductor wafer probing station. EDMR is an ultrasensitive electron paramagnetic resonance technique with the capability to provide detailed physical and chemical information about reliability limiting defects in semiconductor devices. EDMR measurements have generally required a complex apparatus, not typically found in solid-state electronics labo… Show more

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Cited by 8 publications
(2 citation statements)
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“…At the same time, methods have been developed to apply these same techniques to power electronics applications and on a level that will be applicable to production line quality control measurements. 166 More importantly perhaps are synergistic efforts that correlate the results from different techniques. This has been a key approach for defect identification and to elucidate the atomic origin of a signal for a specific technique.…”
Section: Comparison Of Techniquesmentioning
confidence: 99%
“…At the same time, methods have been developed to apply these same techniques to power electronics applications and on a level that will be applicable to production line quality control measurements. 166 More importantly perhaps are synergistic efforts that correlate the results from different techniques. This has been a key approach for defect identification and to elucidate the atomic origin of a signal for a specific technique.…”
Section: Comparison Of Techniquesmentioning
confidence: 99%
“…710,711 Here, electrically detected magnetic resonance (EDMR) is one technique that has recently shown the ability to quantitatively detect 795 and identify the structure of defects [796][797][798] in simple MIM devices and CMOS transistors [796][797][798][799][800] with wafer level probing capability. 801 Related Josephson junction defect spectrometers have also recently been developed for directly probing TLS defects in superconducting qubit devices. 802,803 It also important to note that the insulating nature of dielectric materials can present additional challenges to more established chargebased techniques such as the scanning and transmission electron microscopies (SEM/TEM) most commonly utilized for imaging and dimensional metrology (film thickness, device critical dimensions).…”
Section: The Other M's: Metrology and Modelingmentioning
confidence: 99%