2012
DOI: 10.1063/1.4746276
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Volatile resistive switching in Cu/TaOx/δ-Cu/Pt devices

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Cited by 77 publications
(70 citation statements)
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“…Whereas, previously reported TS property in ECM devices are usually observed at low compliance current (Icc, typically, < 100 µA), and majority of these works were focused on unidirectional TS selector characteristics, which remarkably limit the bipolar applications. [15][16][17][18] In this work, we demonstrated a bidirectional TS characteristic in ZrO 2 -based ECM devices by adopting the volatility of the conductive filaments and an proper programming operation Stable TS properties were confirmed even under high compliance currents, which are beneficial to practical large-scale integration applications This CMOS-compatible TS behavior presents great potential for selector applications in crossbar arrays.…”
mentioning
confidence: 79%
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“…Whereas, previously reported TS property in ECM devices are usually observed at low compliance current (Icc, typically, < 100 µA), and majority of these works were focused on unidirectional TS selector characteristics, which remarkably limit the bipolar applications. [15][16][17][18] In this work, we demonstrated a bidirectional TS characteristic in ZrO 2 -based ECM devices by adopting the volatility of the conductive filaments and an proper programming operation Stable TS properties were confirmed even under high compliance currents, which are beneficial to practical large-scale integration applications This CMOS-compatible TS behavior presents great potential for selector applications in crossbar arrays.…”
mentioning
confidence: 79%
“…to oxidize the filament atoms, the filament may rupture spontaneously before the negative reset voltage is applied. Actually, volatile threshold switching (TS) characteristics have been frequently observed in some switching materials, such as La1-xSrxMnO3, 13 TaOx, 15 SiO2, 16 TiO2 17 and ZrO2/TiO 2 . 18 This volatile property can be utilized as a selector in series with a memory device to suppress the sneak path problem in high density crossbar arrays.…”
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confidence: 99%
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“…Moreover, a thin interfacial layer has already been associated to resistive switching volatility due to ions self diffusion in oxide systems. 10 The equation describing the net ion current under the action of an external electric field is stated as follows: 31…”
Section: Discussionmentioning
confidence: 99%
“…17 When the ECM device is programmed under a low current compliance, the unstable filament is formed. 18,19 Accordingly, the spontaneous selfrupturing of the unstable filament occurs as the applied bias voltage removing, which leads to a TS behavior. 20 The metallic filament is considered to be formed by migrating of metal ions from the oxidizable electrode toward the inert electrode when a positive bias voltage is applied to the oxidizable electrode.…”
Section: © 2018 Author(s) All Article Content Except Where Otherwismentioning
confidence: 99%