Viscoplastic characterization and post-rupture microanalysis of a novel lead-free solder with small additions of Bi, Sb and Ni

Tao, Quang Bang; Benabou, Lahouari; Le, Van-Nhat; Hwang, Honam; Luu, Duc Binh

doi:10.1016/j.jallcom.2016.10.025

Cited by 37 publications

(12 citation statements)

References 30 publications

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“…[7][8][9][10][11][12][13][14][15][16] Furthermore, in automotive industry particularly, a novel lead-free solder, namely, InnoLot, has been created based on SAC387 solder with three small supplements of bismuth (Bi), antimony (Sb) and nickel (Ni). [17][18][19][20] The beneficial effects of these elements addition to tin-silver-copper (SAC) solder materials have been showed in previous studies. 8,15,16 Compared with conventional SAC solders, the InnoLot solder is characterized by microstructural refinement, solution strengthening and better toughness due to IMCs layers formed with Ni, Bi and Sb additions.…”

Section: Introductionmentioning

confidence: 92%

“…Many studies found in the literature have demonstrated that the behaviours of the lead‐free solders are indeed improved by small additions of Cu, Ni, Fe, Ce, Sb, Zn and so forth 7–16 . Furthermore, in automotive industry particularly, a novel lead‐free solder, namely, InnoLot, has been created based on SAC387 solder with three small supplements of bismuth (Bi), antimony (Sb) and nickel (Ni) 17–20 . The beneficial effects of these elements addition to tin‐silver‐copper (SAC) solder materials have been showed in previous studies 8,15,16 .…”

Section: Introductionmentioning

confidence: 99%

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Temperature‐dependent fatigue modelling of a novel Ni, Bi and Sb containing Sn‐3.8Ag‐0.7Cu lead‐free solder alloy

Tao

Benabou

et al. 2020

Fatigue Fract Eng Mat Struct

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Low-cycle fatigue testing of a lead-free solder (InnoLot) based on Sn-3.8Ag-0.7Cu (SAC387) with three simultaneous additions of bismuth, nickel and antimony was conducted using miniature-sized fatigue specimens at different temperatures and strain amplitudes. The experiments show a decline of the load capacity of the solder alloy with the number of loading cycles. The fatigue life of the solder is also decreased by the level of imposed temperature. The temperature-modified Coffin

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Section: Introductionmentioning

confidence: 92%

Section: Introductionmentioning

confidence: 99%

Temperature‐dependent fatigue modelling of a novel Ni, Bi and Sb containing Sn‐3.8Ag‐0.7Cu lead‐free solder alloy

Tao

Benabou

et al. 2020

Fatigue Fract Eng Mat Struct

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“…The solder has begun to come into use in the packaging of some microelectronics components and devices, especially in car industry. Some previous studies have demonstrated that the mechanical properties like thermal cycling, fatigue life of InnoLot solder have improved by adding some elements Ni, Bi and Sb [4,5].…”

Section: Methodsmentioning

confidence: 99%

“…. [1][2][3][4][5]. The behaviors of these solders have been found to be particularly dependent on the amount of the reactive constituent element of the solders.…”

Section: Introductionmentioning

confidence: 99%

Experimental and numerical investigations of full-field strain measurement and fracture parameter of lead-free solder using DIC technique

Bang¹,

An²,

Benabou³

et al. 2020

Vietnam J. Mech.

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Newly developed lead-free solder alloys, which contain doping some elements such as Ni, Bi, Sb, Al, ... have improved properties with respect to the conventional solder alloys, particularly in terms of resistance to creep. Their high performances are specifically desired in applications of power electronics where they are used for the electrical interconnections between the components. Up to now, studies on their resistance to rupture remain relatively limited. Yet the comprehension of fracture behavior is essential for the correct design of the electronic packages which must be robust against fatigue and vibrations loads. In this study, rupture of notched SENT specimens fabricated from the InnoLot lead-free solder alloy is investigated. The tests are performed with the help of a micro-tensile testing machine equipped with an optical system for full-field measurements with Digital Image Correlation (DIC). The images are taken at successive steps of deformation and the displacement field is measured in a region of interest (ROI) which is the singularity dominated zone surrounding the plastic zone at the crack tip. The procedure consists then in comparing the measured field with the theoretical field given by the Williams’ solution. In addition, the stress intensity factor is calculated by fitting the analytical fields to the experimental data. The effects of the size and shape of the zone of data collection, as well as that of the number of terms considered in the Williams’s expansion series, are examined in the study. Finally, a method is also proposed for the automatic crack tip detection

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“…This will result in the mixing of tin-lead and lead-free metallurgies. The mixing of metallurgies can induce new reliability concerns [4,5]. Present study is focused on enhancing solder joints by using composition of solder paste and nanoparticle.…”

Section: Introductionmentioning

confidence: 99%

Experimental Method on Solder Joint of Ball Grid Array Using Reflow Oven

Mohamed¹,

Mohd²,

Abdullah³

et al. 2018

IJCRSET

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Modern applications need electronic systems to operate at high temperature. Mainly in automotive applications which leads to large temperature differences between ambient and operating temperatures. One of the most critical consequences occurs in dealing with thermo-mechanical stress which are created on solder joints due to mismatch of Coefficients of Thermal Expansion of electronic package and printed circuit board. The thermo-mechanical stress due to temperature cycles plays a fundamental role to increase life of electronic components. This study to investigate the solder joint strength by using Pb free SAC 305 solder paste on solder joint. Experiment has been carried out by IR reflow oven with different types of solder paste and thermal profile. Importantly, SAC 305 was used during the experimental process with different types of thermal profile setting in order to generate optimum results.

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Viscoplastic characterization and post-rupture microanalysis of a novel lead-free solder with small additions of Bi, Sb and Ni

Cited by 37 publications

References 30 publications

Temperature‐dependent fatigue modelling of a novel Ni, Bi and Sb containing Sn‐3.8Ag‐0.7Cu lead‐free solder alloy

Temperature‐dependent fatigue modelling of a novel Ni, Bi and Sb containing Sn‐3.8Ag‐0.7Cu lead‐free solder alloy

Experimental and numerical investigations of full-field strain measurement and fracture parameter of lead-free solder using DIC technique

Experimental Method on Solder Joint of Ball Grid Array Using Reflow Oven

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