The clamping mechanism plays an important role in obtaining high-quality products of the injection molding process. The clamping mechanism of five-point double-toggle has been widely used for the high-speed plastics injection molding machine. The purpose of this paper is to optimize the five-point double-toggle clamping mechanism through multi-body dynamics analysis. This work also provides guidelines and a clear understanding for designing the clamping system in an injection molding machine with various clamping forces. The theoretical calculation has been handled first and then the computational model has been verified in this study. In addition, the effects of clamping forces on the main dimensions, including movable-fixed plate thickness, tie-bar diameter and average link cross-section have been investigated theoretically and numerically. The results show that the optimal design allows reaching a high force amplified ratio and that the obtained mechanism has good kinematic performance and works steadily with lower energy consumption and lower cost than the preliminary design. Moreover, the relationships between the parameters such as the critical angles of the double-toggle clamping mechanism, the ratio of force amplification and the stroke of movable mold have been found in this work. The optimized parameters will yield useful knowledge to design and manufacture the clamping mechanism of the micro injection molding machine in practice.
Newly developed lead-free solder alloys, which contain doping some elements such as Ni, Bi, Sb, Al, ... have improved properties with respect to the conventional solder alloys, particularly in terms of resistance to creep. Their high performances are specifically desired in applications of power electronics where they are used for the electrical interconnections between the components. Up to now, studies on their resistance to rupture remain relatively limited. Yet the comprehension of fracture behavior is essential for the correct design of the electronic packages which must be robust against fatigue and vibrations loads. In this study, rupture of notched SENT specimens fabricated from the InnoLot lead-free solder alloy is investigated. The tests are performed with the help of a micro-tensile testing machine equipped with an optical system for full-field measurements with Digital Image Correlation (DIC). The images are taken at successive steps of deformation and the displacement field is measured in a region of interest (ROI) which is the singularity dominated zone surrounding the plastic zone at the crack tip. The procedure consists then in comparing the measured field with the theoretical field given by the Williams’ solution. In addition, the stress intensity factor is calculated by fitting the analytical fields to the experimental data. The effects of the size and shape of the zone of data collection, as well as that of the number of terms considered in the Williams’s expansion series, are examined in the study. Finally, a method is also proposed for the automatic crack tip detection
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