Modern applications need electronic systems to operate at high temperature. Mainly in automotive applications which leads to large temperature differences between ambient and operating temperatures. One of the most critical consequences occurs in dealing with thermo-mechanical stress which are created on solder joints due to mismatch of Coefficients of Thermal Expansion of electronic package and printed circuit board. The thermo-mechanical stress due to temperature cycles plays a fundamental role to increase life of electronic components. This study to investigate the solder joint strength by using Pb free SAC 305 solder paste on solder joint. Experiment has been carried out by IR reflow oven with different types of solder paste and thermal profile. Importantly, SAC 305 was used during the experimental process with different types of thermal profile setting in order to generate optimum results.
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