Temperature‐dependent fatigue modelling of a novel Ni, Bi and Sb containing Sn‐3.8Ag‐0.7Cu lead‐free solder alloy

Tao, Quang Bang; Benabou, Lahouari; Le, Van Nhat; Nguyen, Ngoc A.; Nguyen‐Xuan, H.

doi:10.1111/ffe.13313

Cited by 7 publications

(3 citation statements)

References 28 publications

(79 reference statements)

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“…In addition, the SAC405 solder joints accumulated the lowest stress, plastic strain, and creep energy density magnitude, thus the highest fatigue life. The outcomes show that the SAC305 solder joint has a margin of error േ12% higher than those reported by the investigators why SAC387 is within the margin of error of 18.5% lower than the result obtained by Tao et al [21] for the SAC387 solder alloys than those obtained in this work. This shows comparable relations between the researchers' results and the findings from this work.…”

Section: Stress-strain Hysteresis Loop Relationship and Thermal Fatigue Life Predictions For Solder Jointcontrasting

confidence: 49%

Creep-Fatigue Behaviours of Sn-Ag-Cu Solder Joints in Microelectronics Applications

Depiver¹,

Mallik²,

Lu³

et al. 2021

Advances in Transdisciplinary Engineering

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Electronic manufacturing is one of the dynamic industries in the world in terms of leading technological advancements. Electronic assembly’s heart lies the ‘soldering technology’ and the ‘solder joints’ between electronic components and substrate. During the operation of electronic products, solder joints experience harsh environmental conditions in terms of cyclic change of temperature and vibration and exposure to moisture and chemicals. Due to the cyclic application of loads and higher operational temperature, solder joints fail primarily through creep and fatigue failures. This paper presents the creep-fatigue behaviours of solder joints in a ball grid array (BGA) soldered on a printed circuit board (PCB). Using finite element (FE) simulation, the solder joints were subjected to thermal cycling and isothermal ageing. Accelerated thermal cycling (ATC) was carried out using a temperate range from 40°C to 150°C, and isothermal ageing was done at −40, 25, 75 and 150°C temperatures for 45 days (64,800 mins). The solders studied are lead-based eutectic Sn63Pb37 and lead-free SAC305, SAC387, SAC396 and SAC405. The results were analysed using the failure criterion of equivalent stress, strain rate, deformation rate, and the solders’ strain energy density. The SAC405 and SAC396 have the least stress magnitude, strain rate, deformation rate, and strain energy density damage than the lead-based eutectic Sn63Pb37 solder; they have the highest fatigue lives based on the damage mechanisms. This research provides a technique for determining the preventive maintenance time of BGA components in mission-critical systems. Furthermore, it proposes developing a new life prediction model based on a combination of the damage parameters for improved prediction.

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Section: Stress-strain Hysteresis Loop Relationship and Thermal Fatigue Life Predictions For Solder Jointcontrasting

confidence: 49%

Creep-Fatigue Behaviours of Sn-Ag-Cu Solder Joints in Microelectronics Applications

Depiver¹,

Mallik²,

Lu³

et al. 2021

Advances in Transdisciplinary Engineering

View full text Add to dashboard Cite

show abstract

“…Fatigue is essentially a process consisting of the formation, aggregation, and growth of microcracks during the cyclic loading, leading to strength reduction and ultimate fracture failure. Recently, many researchers investigated the mechanical properties and reliability of solder materials by performing theoretical and experimental studies by focusing on the viscoelastic response of the solder materials in the specific environments 13–15 . They 16,17 investigated the Anand constitutive model for the lead‐free solder under uniaxial tension and analyzed the stress–strain response of solder joints under different thermal cyclic loading cases in finite element (FE) simulations.…”

Section: Introductionmentioning

confidence: 99%

“…Recently, many researchers investigated the mechanical properties and reliability of solder materials by performing theoretical and experimental studies by focusing on the viscoelastic response of the solder materials in the specific environments. [13][14][15] They 16,17 investigated the Anand constitutive model for the lead-free solder under uniaxial tension and analyzed the stress-strain response of solder joints under different thermal cyclic loading cases in finite element (FE) simulations. With a temperature-dependent cohesion model, the Anand model was used to clarify the temperature and strain rate response of SAC305.…”

Section: Introductionmentioning

confidence: 99%

A new unified creep‐plasticity constitutive model coupled with damage for viscoplastic materials subjected to fatigue loading

Long

Guo

et al. 2022

Fatigue Fract Eng Mat Struct

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A new unified creep-plasticity (UCP) constitutive model coupled with damage is proposed for Sn-3.0Ag-0.5Cu (SAC305), one of the most successfully commercialized Pb-free solders. By calibrating the proposed damage model based on entropy generation, the fatigue issues are elucidated for SAC305 solder at different temperatures and strain rates. After implementing a user-defined material subroutine, finite element simulations with the proposed UCP-damage model are capable of predicting the strength deterioration as the macroscopic response in terms of load-deformation curves. More importantly, the UCP-damage model reveals the damage accumulation and evolution of viscoplastic materials sensitive to fatigue deformation at different temperatures and strain rates. By comparing the predictions with and without damage, the equivalent plastic strains are obviously different when evaluating the thermal cycling fatigue life of electronic packaging structures, which confirms the significance of the UCP model reasonably coupled with the intrinsic description of damage by the concept of entropy generation.

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Influences of rotating magnetic field on microstructure and properties of Sn–Ag–Cu–Sb–Ce solder alloy

Wang

Liu

et al. 2023

J Mater Sci: Mater Electron

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Temperature‐dependent fatigue modelling of a novel Ni, Bi and Sb containing Sn‐3.8Ag‐0.7Cu lead‐free solder alloy

Cited by 7 publications

References 28 publications

Creep-Fatigue Behaviours of Sn-Ag-Cu Solder Joints in Microelectronics Applications

Creep-Fatigue Behaviours of Sn-Ag-Cu Solder Joints in Microelectronics Applications

A new unified creep‐plasticity constitutive model coupled with damage for viscoplastic materials subjected to fatigue loading

Influences of rotating magnetic field on microstructure and properties of Sn–Ag–Cu–Sb–Ce solder alloy

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