2014
DOI: 10.1021/nl404743j
|View full text |Cite
|
Sign up to set email alerts
|

Vertical III–V Nanowire Device Integration on Si(100)

Abstract: We report complementary metal-oxide-semiconductor (CMOS)-compatible integration of compound semiconductors on Si substrates. InAs and GaAs nanowires are selectively grown in vertical SiO2 nanotube templates fabricated on Si substrates of varying crystallographic orientations, including nanocrystalline Si. The nanowires investigated are epitaxially grown, single-crystalline, free from threading dislocations, and with an orientation and dimension directly given by the shape of the template. GaAs nanowires exhibi… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1
1
1

Citation Types

3
134
0

Year Published

2014
2014
2024
2024

Publication Types

Select...
4
3
2

Relationship

2
7

Authors

Journals

citations
Cited by 143 publications
(143 citation statements)
references
References 48 publications
3
134
0
Order By: Relevance
“…89 With this technique, very thin nanowires can be grown. 90 with fi ns as narrow as 30 nm and excellent characteristics have been demonstrated. 91 A summary of the state of the art of top-down fabricated InGaAs MOSFET technology for logic is presented in Figure 3c .…”
Section: From Planar To 3d Device Structuresmentioning
confidence: 95%
See 1 more Smart Citation
“…89 With this technique, very thin nanowires can be grown. 90 with fi ns as narrow as 30 nm and excellent characteristics have been demonstrated. 91 A summary of the state of the art of top-down fabricated InGaAs MOSFET technology for logic is presented in Figure 3c .…”
Section: From Planar To 3d Device Structuresmentioning
confidence: 95%
“…89 With this technique, epitaxial growth of III-V homo-and heterostructure NWs on various directions, including Si (100) and scaled NWs with a 25 nm diameter, have been demonstrated. 90 Although these wires have a very high potential for future III-V device integration on Si, the vertical device processing is more challenging.…”
Section: Integration Of Iii-v Semiconductors On Siliconmentioning
confidence: 99%
“…For InAs nanowires changing the growth direction by droplet engineering is particularly challenging, since there is still a debate as to whether InAs nanowires grow with or without an indium droplet [14,15,35]. Catalyst-free growth of InAs nanowires along the 〈100〉 direction can be forced by using SiO 2 nanotube templates, although this strategy does not prevent the formation of stacking defects [36]. As far as we know, template and catalyst-free InAs nanowires have so far been limited to the 〈111〉B growth direction, and no in situ change of growth direction has been demonstrated yet.…”
Section: Introductionmentioning
confidence: 99%
“…In addition, defects that thread on a {111} plane along a trench cannot be blocked and reach the top of the III-V layer. 9 A promising method called template-assisted selective epitaxy (TASE) was recently demonstrated, 12,13 which extends the defect-reduction concepts described above by reducing the dimensions of the elongated mask openings previously used to the small circular cross section of a nanotube, and avoiding the merging of crystallites from separate openings. In this way, threading dislocations can be avoided completely, thus allowing for local integration of III-V nanowires on Si by selective metal-organic vapor phase epitaxy (MOVPE).…”
Section: Introductionmentioning
confidence: 99%